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Ming is currently VP of fabless solutions at PDF Solutions. He was formerly Distinguished Architect at Synopsys, driving chiplet technology strategy and new EDA market development. Prior to Synopsys, he was founding CEO of a Silicon Valley chiplet startup, zGlue. His experience at Intel and at the Samsung foundry focused on manufacturing process/circuit modeling and robust chip design. He holds a Ph.D. in EE and M.S. in MEMS from UIUC, and a B.S. in Physics from Peking University. He is passionate about catalyzing agility, customizability, and security of future semiconductors. He stays connected with frontier technologies and markets while advising global VCs and startups.
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Vice President, Fabless SolutionsPdf Solutions May 2024 - PresentSanta Clara, California, Us -
Vice President, R&DPdf Solutions May 2023 - May 2024Santa Clara, California, Us -
Board MemberWave Photonics Feb 2023 - PresentCambridge, Uk, GbUnleashing the potential of integrated photonics. -
Advisory Board MemberInchfab Dec 2020 - PresentSunnyvale, California, UsRapid, cost efficient microfabrication. -
Distinguished Architect, Eda Group (Formerly Silicon Realization Group)Synopsys Inc Feb 2022 - Jan 2023Sunnyvale, California, UsDiscover and drive new technology directions through strategic partnership with customers, universities / research institutions, and government agencies. Electronic Design Automation Group is home of full-stack semiconductor innovation across design, verification, signoff, test, lifecycle management, TCAD and manufacturing domains for chips: digital or analog, electronics or photonics, monolithic or 3D. -
Distinguished Architect, Strategy & System Architects GroupSynopsys Inc Mar 2021 - Jan 2022Sunnyvale, California, UsResponsible for corporate-level 3DIC solution strategy, encompassing EDA tools, chiplet interface IP, and manufacturing & deployment lifecycle management. -
Co-Founder & CeoZglue Jun 2014 - Jul 2020Mountain View, CazGlue empowers system makers to create optimized-for-purpose, secure, and miniaturized single-chip solution, through rapid heterogenous integration of chiplets on silicon. Our core technology includes Smart Fabric, a programmable active silicon interposer, and ChipBuilder, a cloud-based integrated design and verification environment for 2.5D and 3D IC.We established key ingredients for a chiplet ecosystem such as modular software development kits, chiplet library based on commercially available chip-scale-package parts and bare dies, and business models with chip/system makers and foundries / OSATs.We received multiple industry awards, including 3D InCites 2019 Startup of the Year, 3D InCites 2020 Design Tool Provider of the Year and CES 2020 Embedded Technologies Innovation Award.At CES 2020, our company tagline was "Custom Chips on Demand", which was an evolution from the much nerdier version of "We stack chips on demand for connected things" in 2014 or abstract version of "Democratize Innovation" in 2018. -
Director Of Engineering / Principal Engineer, Design Technology GroupSamsung Electronics Jun 2013 - Jun 2014Suwon-Si, Gyeonggi-Do, KrLed a team conducting SoC design methodology R&D and foundry customer support / enablement. -
EntrepreneurStealth Startup Oct 2012 - Jun 2013Machine learning, cloud software development.
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Vp Of EngineeringJune Blackbox, Inc. Jul 2011 - Oct 2012Machine learning, quantitative trading model, software development.
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Senior Staff EngineerSamsung Electronics May 2010 - Jul 2011Suwon-Si, Gyeonggi-Do, KrSoC reliability and yield R&D. -
Senior Staff Architect, Soc Architecture Group, Atom And Soc DevelopmentIntel Corporation Jun 2006 - May 2010Santa Clara, California, Us- Circuit designer, with focus on low power and DFX (testability, reliability, manufacturability).- In 2008, led a corporate-level technology strategic long-range plan (TSLRP) on powering "small" things through energy harvesting technology assisted by circuits, architecture, and software optimization. - 15+ US patents.
Ming Zhang Skills
Ming Zhang Education Details
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University Of Illinois Urbana-ChampaignEe -
University Of Illinois Urbana-ChampaignEe -
Peking UniversityPhysics
Frequently Asked Questions about Ming Zhang
What company does Ming Zhang work for?
Ming Zhang works for Pdf Solutions
What is Ming Zhang's role at the current company?
Ming Zhang's current role is VP at PDF Solutions.
What is Ming Zhang's email address?
Ming Zhang's email address is zm****@****sys.com
What is Ming Zhang's direct phone number?
Ming Zhang's direct phone number is +140851*****
What schools did Ming Zhang attend?
Ming Zhang attended University Of Illinois Urbana-Champaign, University Of Illinois Urbana-Champaign, Peking University.
What skills is Ming Zhang known for?
Ming Zhang has skills like Soc, Semiconductors, Circuit Design, Asic, R&d, Ic, Vlsi, Verilog, Digital Signal Processors, Eda, Cmos, Software Development.
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