- Performs device and process design, specification reviews, prototype verifications and validations.- Works closely with a cross-functional team for process development, process qualification, pre-production builds, and production transfer. - Participates in engineering projects such as material reviews and evaluations, raw material cost reduction, and yield improvements.

- Managed Assembly Front-of-line processes: Magnet Attach and Capacitor Attach.- Process Set-up and development: Optimized process parameters, improved existing methodologies, supported equipment qualifications, and lead material qualifications/evaluations, cost reductions projects, and yield improvement actions.- Process line sustaining: addressed line issues and participated in technical problem solving.-Standardization and documentations: generated and updated specifications… Show more - Managed Assembly Front-of-line processes: Magnet Attach and Capacitor Attach.- Process Set-up and development: Optimized process parameters, improved existing methodologies, supported equipment qualifications, and lead material qualifications/evaluations, cost reductions projects, and yield improvement actions.- Process line sustaining: addressed line issues and participated in technical problem solving.-Standardization and documentations: generated and updated specifications, interpreted quality inspection criteria, and prepared technical reports on evaluations.- Facilitated process trainings and reviewed updates for training manuals. Show less

- Managed Assembly Package/Backend/End-of-line processes: SMT, Mold, Laser Marking, Solder Ball Attach, Saw Sorter, Form Grinding. - Supported engineering projects in semiconductor Failure Analysis: X-Ray, CSAM/SAT, DC Test, Cross Sectioning, Laser Decapsulation, Acid Decapsulation, SEM/EDX, FTIR. - Lead and performed Design of experiments (DOE), New Product Introductions, and material qualifications.- Analyzed data on Statistical Process Controls (SPC). - Developed and reviewed… Show more - Managed Assembly Package/Backend/End-of-line processes: SMT, Mold, Laser Marking, Solder Ball Attach, Saw Sorter, Form Grinding. - Supported engineering projects in semiconductor Failure Analysis: X-Ray, CSAM/SAT, DC Test, Cross Sectioning, Laser Decapsulation, Acid Decapsulation, SEM/EDX, FTIR. - Lead and performed Design of experiments (DOE), New Product Introductions, and material qualifications.- Analyzed data on Statistical Process Controls (SPC). - Developed and reviewed technical, process and material specifications. - Spearheaded manufacturing improvements (Quality, Defect PPM, Yield, OEE, Cost Reductions and UPH).- Performed Failure Analysis on root cause determination and generate corrective and preventive actions on solving line issues. - Conducted product and process verifications to support mass production. Show less