Liaisons role between internal development team and outside suppliers. Assuring early supplier involvement during the design phase. Responsible for supplier related documentation during the development process. Identifying and solving (potential) structural problems in depth.

Technical leader for new development of a patented outdoor copper and fiber optic connector family used in harsh environments i.e. antennas and RRU’s for mobile networks. Responsible for design, validation testing and qualification. International experience through on-site supplier selection and initial product release in China. Successful validation testing completed with respect to water tightness (IP 65/67) and mechanical / environmental requirements.Mentor role for new development engineers.

Designer of 8-row high speed (25 Gbps) interconnect within a cross-functional team of signal integrity engineers and mechanical engineers. Prototyping these products through Chinese suppliers and subsequent successful SI validation. Designer of zQSFP+ product; a 4-channel high-speed I/O product and performed functional release at TE Shunde China. Developing multiple interconnect components made out of metal and plastic for high volume production. Teaming up with process engineers for injection molding, stamping, plating and assembly processes.Pcboard press-fit / solderless connection specialist and conducting the transition to lead-free / RoHS compliant products. Leader of cost reduction programs.

Leading a group of Engineers responsible for product extensions of pcboard-to-pcboard connections. Extensive on-site experience with - and provisionally responsible for - molding-, stamping-, plating- and assembly processes. Providing customer support during role-out, program introduction and after-sales.

Program Managers role for the introduction of a new IEC standardized connector program out of AMP’s European Development Centre into the manufacturing facility in Den Bosch. All required (Engineering) activities from proto order planning to product release at multiple global OEM's.