Morgan Chen Email & Phone Number

Moorpark, CA, US

Falls Church, VA, US

• Functional Manager for team of 13 Principal Investigators, Subject Matter Experts, and support staff developing quantum sensor technologies for future Positioning, Navigation, and Timing (PNT)
• Design support and test of part obsolescence driven redesign in legacy Zero-Lock Laser Gyroscope (ZLG) product line

Camarillo, California, US

• Manage Multiple Engineering Design Teams covering Amplifier, Converter, Master Local Oscillator, & Passives product lines with annual revenues of $40M. Introduced and established new concepts for integrated product.
• Develop new Solid-State Power Amplifier product line in 2021. Worked collaboratively with operations and quality departments to establish new travelers/processes, quality requirements and inspection criteria of.
• Generate roadmaps with inputs from SMEs, business development team, and suppliers to address future market needs and present IRD proposals to Executive team. Generate technical packages for new proposals. Lead approved.

Melbourne, Florida, US

• Manage direct reports comprised of engineers supporting amplifier design engineering group. Responsibilities include technical mentorship, process compliance training, staff review, KPI reporting, audit support, and.
• Own IR&D developments including proposals, program management, full P&L responsibility, and execution. Includes development of collaborative university research and generate technology roadmap
• Technical Ownership of LCAMP (linearized channel amplifier) and SSPA (solid-state power amplifier) spaceborne module product lines for commercial/defense satellite markets from L-band through V-Band frequencies
• Technical interface between customers and internal team through product life cycle from RFI/RFQ/proposal stage, compliance matrix generation, cost/price generation and review, product development, Subcontractor Data.
• Cost Accounting Management under Earned Value Management Systems (EVMS) including developing time-phased budgets and tracking engineering CPI/SPI metrics on programs totaling ~$10M annually

Espoo, Southern Finland, FI

• Lead electrical package design for RF products across 700 MHz to 86 GHz
• Mentor work of junior engineers by directing day-to-day technical tasks and schedule, and coordinate with system and active IC design stakeholders to create proposals for future technical/industry directions
• Design, model extraction, and characterization of integrated passive circuits including filters and diplexers in multiple foundry processes at nodes from 130 nm to 45 nm SOI CMOS and integrated passive devices (IPD)
• Design of laminate MCMs and demo-boards engaging in EM/circuit co-simulation across chip line-up of baseband transceiver, PA modules, and front-end modules (FEM) for 5G consumer networking products including handsets.

Shenzhen, Guangdong, CN

• Design and characterize opto-electro (OE) modulators in 130 nm SOI CMOS silicon photonics using transient and harmonic balance techniques with devices measured to offer >20 GHz bandwidth with optical loss and.
• Design and characterize devices and 3D packages in technologies including silicon, GaAs, SiGe, and InP including MZM, driver, and TIA to ensure operation at 100 GBPS and up
• Develop drivers and TIAs in collaboration with internal and external partners from initial concept through qualification to production in aspects of electrical specification, IC design, RF signal integrity, and Power.
• Design of Receiver Modules including low-cost 40G DQPSK, 100G client-side CFP, and 100G line-side Integrated Coherent Receiver (ICR) transponder links for Optical Transport Network (OTN) covering aspects of contract.
• Develop characterization techniques to capture optical s-parameters, eye-diagrams, sensitivity, BER vs. OSNR, group delay, chromatic dispersion, etc. on 40G/100G muxes/demuxes, PDs, receivers, TIAs, EML drivers.
• Directly Manage one contract technician from recruitment, interview, hire, and daily assignments

US

• Lead design and development for all advanced broadband RF/microwave Quad Flat No-lead (QFN) semiconductor products. I demonstrated unique technologies including LCP, overmold leadframe, air-cavity leadframe, and.
• MMIC design and layout for 18 GHz mixer, prescaler, Wilkinson combiners, Lange couplers, etc.
• Measured s-parameters (gain, isolation, return losses), conversion losses (mixers and frequency multipliers), image rejection, harmonic suppression, NF, PiPo, P1dB/IP3, dynamic range, phase noise, modulation.

Davis, California, US

• Developed novel applications of liquid crystal polymer (LCP) for microwave components
• Developed thin-film package for RF MEMS switches
• Developed system-in-package (SiP) integration of a hybrid 2-bit phase shifter
• Trained and managed undergraduate and graduate students
• Wrote external funding proposals

Niskayuna, New York, US

• EM simulations for design of RF MEMS package
• Process development of an LCP (near) hermetic package for RF MEMS switches
• Design of a true-time delay (TTD) system-in-package (SiP) phase shifter module

• Analytically designed, fabricated, and measured a patch antenna on Duroid substrate on HP 8719
• Designed and demonstrated prototype of a multi-band/multi-mode direct conversion transmitter for wireless applications operating at both 1.9 GHz and 5.8 GHz

• Designed an optical device to measure light intensity at small angles
• Surveyed and ordered commercially available devices for optimal design
• Constructed and demonstrated a working prototype

Arlington, VA, US

• Authored imaging and geomensuration software
• Built framework for decoding and viewing satellite images

Berkeley, CA, US

• Diagnosed and repaired computers
• Maintained the residential network and monitored traffic

• Verified SPICE model test outputs against measured device data
• Worked closely with post-doc to ensure accurate reporting

Ph.D., Electrical Engineering

Bs, Electrical Engineering And Computer Science

Education record