Managed Field Service personnel and all extended warranty service contracts (a fleet of 95 systems).
Provide applications level support for fault isolation and reverse engineering labs for many companies across the globe, including NXP, Intel, AMD, Nvidia, NSA, DOD, FBI, and Sandia National Labs, using microscopy with NIR laser probing and emission detection.
Perform new tool install qualifications.
Work with customers to provide continuous software and hardware debugging and improvement.
Provide first level of troubleshooting for applications level issues, as well as hardware issues, prior to any FSE involvement.Provide applications level training for all engineers and technicians.Software and hardware development.

Created an application that dramatically improves the accuracy, reliability and condenses the appliance issuing process by half.

2004 - 2010 Process Development Engineer (Metrologist)Designed and conducted experiments aimed at evaluating new technology capabilities and or equipment that would be used in the next generation of microprocessor manufacturing (evaluated equipment based on safety, precision, accuracy, output, and mean time between failures, maintenance durations, support costs, and technological depreciation).Wrote hundreds of white papers and specifications aimed at documenting the implementation of new technologies and or capabilities, as well as aid users and technicians at using and maintaining the equipment.Successfully transferred measurement technologies and capabilities to Intel Fabs around the world (Israel, Ireland, multiple locations in US).Developed and maintained matching methodologies (Six Sigma) that created an optical metrology measurement fleet that consisted of over 20 tool sets with precision variation that was undetectable by users. Maintained a working relationship with KLA-Tencor, Bio-Rad, and Rudolph (including field and application engineers) to increase tool performance on a continuous basis, which resulted in safety innovations and measurement algorithm inventions.Characterized and delivered dispersion models for many proprietary exotic thin films used in back end chip fabrication process. Trained new engineers on matching and maintenance methodologies for optical measurements across the tool set fleet.1998 - 2004 Engineering TechnicianImplemented a golden algorithm library drive for the back end transparent thickness measurement equipment, serving as a universal measurement standards saving thousands of engineering hours in troubleshooting measurement mismatches.Performed the install and qualification on two high resolution profiler equipment sets to support planar front and back end process improvements.Performed the process qualification of transparent film thickness equipment to support back end lithography production.

Became a night shift supervisor.Became one of the primary experts on accurately allocating technical recourses to help maintain an ultra-low inventory.Received a letter of appreciation for achieving the highest class GPA in the rigorous avionics military program.