Muhammad Faisal Email & Phone Number

Canada

Canada

• Worked with customers to understand design requirements & customer needs.
• Worked on pre-BOM and stack-up for sales team to provide customer with quotation (design/assembly/fabrication).
• Worked on long lead time parts, suggested cross part to customer & assisted purchasing team to tackle problematic parts during procurement process.
• Provided application & assist how to optimize design for signal integrity (SI) & power integrity (PI).
• Analyzed S parameters from pre-simulation result & worked closely with SI team to make layout optimize (defining via size, ground structure etc.) ensuring good signal quality in the finish product.
• Worked closely with fabrication house to compile stack-up, material selection, core thickness, impedance control, HDI, micro/blind/buried via, HDI stack-up, single/multi lamination, fine pitch.

Singapore

• Worked as Technical Project Manager (TPM) to drive PCB Design Process, manage overseas projects and meeting deadlines.
• Worked closely with sales team to provide customer with quotation design, assembly, and fabrication.
• Liaising with customer and work on their needs and propose technical consultancy during all phases of design.
• Provide application & assist how to improve/optimize design from signal integrity & electrical point of view.
• Analyzing S Parameters (Insertion Loss/Return Loss) from Pre-Simulation result & working closely with Signal Integrity team to make layout optimize (defining Via size with ground structure etc.) and to ensure good.
• Prepare guidelines for design engineer as per customer requirements and high speed design rules.

Singapore

• Implemented prototype model according to engineering instructions, technical manuals & knowledge of signal and power integrity.
• Designing & verification of high performance digital, analog & mixed signal multiple layer printed circuit board (DUT Interface Board/Program Card) using Cadence-HDL, Cadence Allegro, P-CAD, AutoCAD, GcCAM etc.
• Designing & verification of controlled impedance, RF, minimum cross talk, and multiple impedance transmission lines using special CAD design techniques for Test Interface Unit (PCB).
• Schematic capturing, component development and library management.
• To generate manufacturing files (Gerber, assembly drawing etc.), CAD/CAM engineering & documentation of design including netlist, netlength, BOM etc.
• Design for manufacture (DFM), helps in circuit/components assembly and test (DFT) in support of Engineering.

Masters

Education record