Mutharasu Devarajan, Ph.D. Email & Phone Number

25+ years of research and industrial experience in areas of advanced materials, semiconductor thin films, characterization and device development for electronic packaging. Established Materials Centre of Excellence (MCoE) in Western Digital with focus on development, test and analysis of advanced packaging materials for Solid State Drives (SSDs). Enabling packaging solutions for new-gen SSD products that include selection of advanced materials, substrates, surface nano coatings, thermo-mechanical testing and provide device level package characterization. Leading materials group at WD to address material quality challenges, develop material road maps, enable next-gen materials for NPI and provide comprehensive analysis for material qualification. Drive innovation with focus on 3D printing for advanced product fabrication technologies and strategies to support SSD & SiP manufacturing. Innovative leadership with 250+ research publications in the areas of advanced materials thermal solutions, electronic packaging and thermo-mechanical characterizations.Lead, Supplier Strategy Engagement & Development Develop and align SSD packaging material roadmap strategies with supplier material roadmaps for key critical SSD products: PCle connectors, Gold Fingers, material selection for PCBs, TIM Pads, LTIM, Heat sinks, Heat pipes, Auto-solder paste and Rework under fills. Support R&D efforts to identify and develop suppliers to provide key innovation technologies to align with material roadmap including proof of concept activities, negotiating and managing joint development agreements. Lead supplier selection and capability bench-marking for advanced material packaging technologies and enable SSD packaging material integration. Engage with multiple material suppliers to standardize test and characterization methodologies, compare test standards and evaluate raw materials & processes. Audit material supplier sites to ensure compliance to material qualification for test methods, fabrication and packaging processes

Listed skills include Semiconductor Material Charaterization, Electronic Packaging Applications, Thermal Management Solutions For Microelectronics, Materials Development, and 1 others.