Nandha Kumar Email & Phone Number

Bengaluru, Ka, In

Bengaluru, Karnataka, India

Bengaluru Area, India

Noida Area, India

Heading its semiconductor business Engineering division ( Product & process)Different densities of Pen drive design & launchHave designed & processed MicroSD package upto 8 die stacks ( 32GB)Have designed & processed COB-uUFD upto 8 die stacks ( 32GB)Bare die attach for cost effective solution on Pen drivesAchived yield of 99.8%Introduced copper wire bonding for cost effective solutions in memory products.

Noida Area, India

Job Profile• Manage/Develop strategies for NPI department in developing new products• Handle New business / Customer engagement from Product Conceptualization to High Volume Manufacturing• Process Development/Qualification/Ramp-up on New products• Proof-of-Concept, Prototype sample development , New Supplier Qualification on new products• Key In charge of implementing Semiconductor assembly line for their new business• Responsible for selecting suitable equipments, BOM ,process materials etc• Planning Control plan & flow chart for new products / process• Conducting CoO analysis for all semiconductor equipments• Data preparation & presentation for Capex approval from management• Responsibility of new product introduction for business growth(Smart card Chip module , external HDD,LCD TV)• Responsible for process stabilizationAchievements• Successfully implemented the semiconductor assembly line starting from scratch • Capital equipments price where reduced from 8M USD to 4.2M USD with strong negotiation skills (And also have good interpersonal relationship with equipment vendors)• Made detailed CoO analysis for machine selections.• Execution of Semiconductor assembly plant from scratch• Selected as key resources of Moserbaer in its SSM division within a year of joining• Successfully implemented SMT line with first pass yield of 99.5%• Cycle time reduction in SMT line

Job Profile•Working in the Engineering Department team where the Equipment / Process / Material / test specs are determined, reviewed and controlled.•Continuous monitoring of product quality at various stages and to take necessary corrective and preventive measures for continuous improvement.•Continuous monitoring of breakdown trends of assembly equipments and ensuring appropriate preventive and corrective measures for increasing machine availability.•Train the staff to do things “RIGHT THE FIRST TIME” to consistently achieve the quality goals of the company•Ensure that products and process standards comply with customer requirements by updating quality system documents.•New Product and New Projects implementation.•Optimizing yield by undertaking DOE & controlling by FMEA & SPC methods.•Submitting 8D reports to the customer & initiating VCAR to vendors.•Design & development of mechanical parts required for process effectiveness.•Define specification to be followed by all Assembly houses and perform periodical audits to ensure compliance to specified requirements.Achievements•Installation of UTC 200 wire bonders/ KNS 8020 / K&S Maxum Ultra wire bonders & giving to production within 24Hrs.•Implemented the assembly process of mobile phone camera.•Successfully established the QFN/LMP/UDFN/DFN in front of line.•Installations of Alphasem die bonder, Disco dicing machine, Plasma cleaner & K&S MaxumUltra machine for production.•Design of lead frames according to product type.•Dicing of 8-inch wafer performed where the m/c capability is only 6 inch.•Implementation of lead frame punching system in the die bonders to prevent lot mix ups.•Prepared an exhaustive maintenance-training manual on the process of wire bonding.•Have been able to maintain the assembly equipments (More than 12 years old) in good condition •Increased the yield to 99.93% from 99.70% by conducting DOE & FMEA.

Mba, Technology Management

Pg, Plastics Engineering

B.E, Mechanical

Education record