Narendra Singh Email & Phone Number

Redmond, Washington, Us

*Reliability qualification of mechanical subsystems including hinges, enclosures, detach mechanisms. *Adhesives reliability testing and modeling. Develop coupon/subsystem level test procedures for PSAs, liquid glue, thermoplastic/thermoset films based on industry test standards (ASTM and ISO)*Lead component, subsystem and system level FEA for DfR and failure analysis. Subsystem include display modules/LCM , PCB including solder fatigue in TC and shock/vibration, device drop etc.

Irving, Texas, Us

Responsible for managing the development of valvetrain systems CAE tools portfolio and for supporting engine divisions with material model calibration and material properties that are required for FEA and Fatigue analysis; maintaining and improving material property database; creating roadmap and strategy for closing the property gaps for all critical components. • Resolved a major engine NPI issue that had early fatigue failure of a HIP die cast aluminum alloy rocker base by reconciling material properties and proposed new design; recommended sand casting as an interim solution for demo builds. • Conducted material characterization and generated properties for 4 production materials including response at high temperature.• Developed material property verification methods using FEA and excel solver. Researched and created thumb rules to derive properties using limited test data and microstructure. Standardized processes to ensure confidence in analysis outputs.• Demonstrated reliability based engineering concepts by calculating strength and stress distribution and predicting probability of failure of a rocker arm. This probabilistic approach has significant cost savings potential over deterministic design approach of fatigue factor. • Team member in developing ICME strategy and selection of commercial common material information platform.

Irving, Texas, Us

I developed physics based and semi-empirical computational models for performance and life prediction of core engine and machine components with focus on facilitating new concept designs and continuous improvement projects. • Developed shot peening simulation process using dynamic FEA to identify root cause of a piston ring failure and guided process change. • Qualified distortion/bending of a divider wall in limp home mode and recommended design changes to improve sealing capacity of a concept dual fuel injector (LNG and Diesel).• Improved Rocker Arm FEA process using Abaqus; achieved $80K/year benefits from a standard work that provides 30% efficiency improvement and enables off-shore deployment.• Delivered value of $300K in one time scrap and labor cost avoidance due to liner scuffing on a medium size engine caused by seal ring pressure. Minimized distortion by analyzing various seal materials and designs.• Developed an induction heat-treatment process. Implemented this process to resolve a weld crack issue in a spline shaft by optimizing the case-hardened profile to meet design requirements.• Solved an idler cracking problem in an excavator by recommending a manufacturing process change. Utilized Fracture mechanics based approach to calculate stress intensity factor and correctly predicted that existing cracks were safe.

Irving, Texas, Us

I managed all aspects of a large engine valvetrain bench, while conducting accelerated durability tests for NPI resolution. I also supported valve design changes and collaborated with supplier on camshaft and other core component field failures.• Saved over $1m in engine test cost and development time by identifying root cause of camshaft lobe failure and running an endurance test DOE on accelerated bench to select permanent corrective action for customer engine builds. Lab engine tests confirmed the validity of the PCA. • Performed FEA to quickly resolve a plunger and barrel failure issue during the development phase of the bench.• Led a team consisting of design and manufacturing engineers, field rep and supplier to resolve a complex field failure issue. Identified that the root cause of leakage through valve stem seal was attributed to damage caused by an assembly tool in a factory. Issue had 10% failure rate@10,000 hrs causing over $600K warranty.• Performed statistical tolerance analysis to resolve an assembly issue of valves sticking when inserted in coated guides. • Coordinated a project to evaluate effect of lower valve lift on port flow coefficient in a large engine using CFD analysis. I optimized the valve and seat design to maintain the performance even with lower lift design.• Carried out a detailed tolerance stack-up analysis for piston to valve clearance for a thicker concept valve designed to reduce wear on one of Caterpillar's large engines.

Irving, Texas, Us

I led several projects with multi-disciplinary teams of engineers, supervisors and key stakeholders in developing CAE tools and processes, facilitating new concept designs and field failure resolutions. Adeptly utilized Six Sigma tools in gathering VOC, conversion to CCRs, Root Cause Analysis (Fishbone), Design of Experiments, Pugh, AHP, p-diagram etc.• Saved over $10M in reduced cost and warranty avoidance by developing and integrating a casting solidification tool with PTC Creo for design engineers. This tool has also reduced casting development time and improved communication with foundries. It is being used by over 200 engineers across multiple product lines. • Developed a valve and seat insert wear model that resulting in reduced engine testing – savings of at least $200K/year. The model captures dynamic impact loading and seating contact stresses. Characterized wear material constants. Good correlation was found with the test rig.

Providence, Rhode Island, Us

• Developed a new technique for extracting diffusivity of all interfaces surrounding electrical interconnects by simulating thermal stress relaxation using 3D FEA and correlating to wafer curvature experiments. These diffusivity values are difficult to measure otherwise and are required to calculate interconnect reliability of an integrated circuit. Obtained grain boundary (Cu/Cu) diffusivity was accurate to within an order of magnitude compared to the published value in literature.• Formulated a plate element (using FORTRAN) that simultaneously characterizes the cohesive, diffusive and curvature properties of thin film interfaces. Verification of element was done using test cases for which analytical solution could be obtained.

Santa Clara, California, Us

• Collaborated with experimenters to identify the appropriate boundary conditions, geometrical and material assumptions for void nucleation simulations in realistic Cu interconnect structure.• Developed an automated FORTRAN routine for generating 3D finite element mesh of a realistic interconnect structure. This mesh included interface elements to account for interface diffusion.• Developed methodology for numerically predicting void nucleation in the interconnect structures, using cohesive zone model. Method correctly predicts the experimentally observed nucleation sites.

Santa Clara, California, Us

• Examined the effect of variation in temperature and activation energy of interface diffusion on stress relaxation of interconnect structures. Improved correlation with experimental data was obtained as a result.• Developed 3D-voltage element, which is the foundation of simulating electromigration.

Conklin, Ny, Us

• Developed models to conduct nonlinear thermo-mechanical analysis (using ANSYS) for predicting fatigue life of various package types such as BGAs, CSPs and QFPs. Solder joints that are known to creep at operating temperatures Predicted life correlated within 2X of accelerated lab testing.• Studied the effect of different design parameters on mechanical reliability of Flip Chip and BGA packages and examined the potential failure modes, which included silicon die-cracking and underfill delamination.• Utilized submodeling and substructuring approaches to reduce the computation time and resources for the stress analysis of various leadless packages e.g. QFP, LCCC etc. Substructuring technique was shown to reduce analysis time by upto 4 times.

Phd, Engineering (Mechanics Of Solids And Structures), Minor In App. Math And Mat. Science

Ms, Electronic Packaging

Be, Mechanical Engineering