1. Development of Ethernet Switches Product and evaluate RFQ feasibility, product specifications discuss with customers.2. Product schematic design/bring-up/ system test/ debugging analyze, collaboration with multiple teams and co-manage the whole project schedule.3. Survey the 2nd source discuss with venders and verification, explore new technology trends (5G, AI trends, chipset)4. Organizing and discussing the test plan with customers, and writing test reports.5. Writing the HW PRD documents (Product Require Specification) and product proposals.Touch Project Experience :1. AI-Edge Switches Server : [Serve as co-project leader](a) Controller : MRVL CPU/ AlleyCat5 + MAC/ Aldrin-3S [1x10G+2xSFP+](b) Ethernet Switching : MRVL OCTEON CPU/ CN102 + MAC/ AlleyCat5X [16x1G+2x2.5G+2xSFP+](c) Computing : Intel GRANITE-RAPIDS-D CPU collation multiple DIMM +Graphics Card Request [2x10G](d) System Backplane : Delivery Control Plane + Data Plane Interface(e) System Fan Board : Control the whole system fan speed connection(f) Manufacture Test Fixture : Emulate the Controller/ Switching/ Computing Purpose2. Ethernet Switches (between 100G ~ 200G-bps) :(a) MRVL MAC/ IRONMAN [24x1G+6xSFP+], [8x1G+4xSFP+](b) MRVL MAC/ AlleyCat5Y [24x1G+6xSFP+], [48x1G+6xSFP+]3. POE++ Daughter Sub-Card :(a) 24-Port 802.3bt (90-Watt)(b) 8-Port 802.3at (30-Watt) for widely VDCIN Range(c) 24-Port 802.3at (30-Watt) + 24-Port 802.3bt (90-Watt)(d) 16-Port 802.3at (30-Watt) + 2-Port 802.3bt (60-Watt)4. RFQ Feasibility for Development Potential Customer : Cisco/ IE1000, Cisco/ Small Bussiness, and Extreme/ V300-Series Next-Gen

1. Developing the X86 platform and modify existing products, discussing product specifications with customers.2. Collaboration between different teams, and management controls the product schedule.3. Verification 2nd source components, and maintain project BOMs.4. Product bring-up/ system functional testing/ dubugging analysis from EVT to MP certification.5. Write and develop product specifications, discuss the verification plans.Touch Project Experience :1. Single Board Computer (w/ MIO) :(a) AMD Ryzen Zen+ R2000-Series for 3.5" SBC Support 5G Module & POE 802.3at(b) Intel Atom ELKHART-LAKE for 2.5" Pico-ITX SBC2. DC-DC Power Module :(a) Wide-Range DCIN Module MIO-Chassis Support POE Controller w/ Isolation Protection

1. Developing the ARM-based platform form-factor, COM-Express, and modify existing products.2. Perform Schematic Design and work with a CAD team on PCB layout & review.3. Understanding of technical principles and concepts in Electrical Engineering.4. Product bring-up and system function testing/ debugging analysis from EVT to MP certification.Touch Project Experience :1. form factor : Intel Movidius Keey-Bay/ HDDL Riser, M.2 2280 & 2242 (M-Key, B+M-Key), DDR4 Uni-DIMM2. Com-Express : Type-10 Row A/B3. AI EVM Boards : Intel Keem-Bay, Intel Thunder-Bay Harbor

1. Co-work the lab projects request for cooperation.2. Handle the machine algorithm verification & testing based on GPU performance.3. Write the proposal and a paper journal.