Nicholas Foo Email & Phone Number

Austin, Texas, Us

Irvine, California, Us

Accomplishment - Successfully released high volumes product to production > 100Mu+ Managing new product introduction. Responsible for bringing product from first IC to production. + Develop test plan for high complexity power amplifier products, 2G, 4G, 5G for mobile devices and automotive.+ Work closely with test engineer for program debugging, test coverage and test time reduction.+ Work closely with wafer foundry, design, product characterization, offshore assembly, test, reliability qualification, FA and production sustaining.+ Strong RF product analytical knowledge and experience. + Strong statistical data analysis knowledge and proficient in Galaxy, Exensio data analysis tool.+ Developed NPI Production Engineering training materials and provides training to new PE.+ Provide statistical tool training, Galaxy, Exensio, SAT.+ Improved bench to ATE correlation for yield improvement and lower PPM.

Irvine, California, Us

+ Managing new product introduction. Project management from phase 0 to volume production. + Create and manage project schedule. Coordinate with Marketing, Design, Layout, Qualification, Characterization, Test, Assembly, production, planner and all NPI related groups. + Responsible in providing clear communication to the team and project status update. + Work on Agile & SAP for projects and documents management. + Manage multiple projects at the same time.

Accomplishment - Successfully setup supply chain, wafer foundry, assembly and test to release first power management product to production to the biggest cell phone company in Korea+ Managing NPI. Product package design, first silicon device validation/characterization test and PVT.+ Identify and qualify wafer foundry as a second source for cost saving. + Identify and qualify assembly and test OSAT from prototype to production both locally and overseas.+ Test plan design, test software/hardware development for most cost effective and high-volume production. + Wafer foundry manager, TSMC (Coordinate with wafer foundry to support design engineering and responsible for wafer mask tape-out).+ Managing OSAT, second sourcing for cost reduction and providing guidance for both engineering and production support (Process and quality improvement). + Perform wafer foundry PCM data analysis, OSAT production SPC monitoring and continuous yield improvement using statistical tools (SEDana, SPC for Excel).+ FA engineering for initial R&D stage and production rejects (X-ray, SEM, SAM, EDX, Photon Emission, Voltage Contrast, Obirch, FIB).

Accomplishment - Successfully release products to high volume production Upstream CATV Amplifier, 2.4GHz to 5.8GHz Frequency Translator, 900MHz/2.4GHz/5.8GHz Low- IF 1.5Mbps Transceiver. Granted RFMD Spotlight Award in year 2009+ Design and develop engineering characterization test hardware for optimum device performance.+ Develop product qualification test hardware. Manage qualification test per MIL/JEDEC standard with ISO certified local reliability test lab, ICE+ Design and develop ATE test hardware for commercial testers with most cost effective and high-volume manufacturability. Multi sites and high throughput load board for Teradyne RF Catalyst, LTX-Credence and ASL 1K test platform.+ Implement preproduction run in local test lab(EAG, Corwil) and transfer to overseas OSAT for high volume production (ASE, AMKOR, STARTSCHIPAC, ISPL and Unisem).

Accomplishment - Successfully setup overseas FA lab and formed FA team+ Support new product introduction. Perform product PVT characterization and reliability qualification.+ Define product electrical characteristic (Gain, Flatness, Return Loss, Power Compression, Noise Figure and max voltage/current rating) + In depth product reliability characterization using HTOL data and define device hot spot Theta JC and improved product MTTF+ Design product reliability monitoring plan in production (HTOL and in chip junction temperature measurement).+ Discrepant Material Report (DMR) coordinator. Work with QA engineer, process engineer and FA team to come up with an immediate containment plan and corrective action. Part of the MRB and CAR review team. + FA engineering. Setup and lead an overseas FA team.Accomplishment - Successfully released 60+ SMT Monolithic Small Signal Amplifier (DC-8GHz) and Miniature SMT Fixed Attenuator (DC-8GHz). Improved product reliability by reducing device junction temperature (from Tj=250°C to Tj=150°C) and increased device MTTF. Developed device junction temperature measurement technique to monitor device Tj for every production wafer lot. Developed failure analysis techniques and published technical article in RF Microwave magazine.