• Maintained and improved the flying probe test and resistor laser trimming areas of a thick film manufacturing facility.• Developed and updated routings, FABs, and BOMs within the surface mount chip resistor product group.• Purchased and qualified new capital equipment to increase production capacity and replace aging equipment.• Troubleshot equipment and process issues to provide quick resolutions to reduce equipment and production downtime.• Worked with operations, quality, and project management to remediate quality issues and ensure on-time deliveries.• Interacted with customers to provide technical feedback for new parts and findings on corrective action requests.• Improved procedures and tools in electrical test area to increase throughput and remove need for engineering to review most production lots.• Participated in continuous improvement teams and weekly failure analysis activities to reduce overall scrap amounts and costs.• Developed new equipment programs and procedures based on new designs or challenges presented by customers.

• Collaborated with product development and operations to develop processes for production of new products within a medical device manufacturing facility.• Developed procedures and process validations to ensure products were built in compliance to design and regulatory requirements.• Improved existing manufacturing processes to reduce cost and improve quality and repeatability.• Participated in risk analyses and ensured that all risks in the design and process were properly mitigated.• Validated new equipment to ensure all equipment and set-up requirements were met for use in production.• Designed new process tooling to reduce cycle times and ensure full verification of non-validated processes.• Developed and validated new inspection methods to ensure full verification of all non-validated processes.• Created part specifications for subassemblies to ensure that all parts were manufactured according to product and user requirements.• Submitted all document and drawing changes through the ECO process.

• Monitored the assembly of semiconductor production equipment to determine areas to reduce costs, cycle times, and scrap material.• Investigated reported manufacturing issues and performed corrective actions as required.• Documented the assembly of a sub-assembly on a new product line and developed work instructions to ensure proper assembly in all future builds.• Updated drawings, work instructions, and bill of materials through the ECO process.• Improved work areas and manufacturing flow through the removal of excess equipment and tools and the creation of specialized toolboxes for each assembly area.

• Investigated potential battery discharge failure modes due to contamination from processing equipment.• Executed testing to qualify purchased components from a new supplier for an existing product line.• Maintained long term wear testing of critical components under various stress and temperature conditions.• Deconstructed defective batteries to determine root cause of failures and deconstructed competitor's batteries to determine potential patent infringement.• Designed test fixtures utilizing Pro/ENGINEER to perform tensile tests on components with unique geometry.

• Developed test procedures to test final product builds against the user requirements specifications.• Executed mock runs of co-worker's test procedures to ensure clarity in instructions and that all specifications are properly tested.• Tested new revisions of user interface software to verify that no bugs were present.• Reviewed bill of materials and component technical specifications to ensure RoHS compliance of new product.