A skilled semiconductor industry professional with a PhD in Electrical and Computer Engineering with 9+ years of process development experience in etch, dep and clean processes. For 7+ years at Lam Research, my work revolved around delivering novel process solutions to semiconductor plasma etch processes for memory & logic applications, resolving plasma etch hardware related dynamic customer problems and follow-up on CIP activities. Currently, as a Senior Engineering Manager, I drive cross-functional team collaborations to deliver products for diverse and global customer needs. My ability to multi-task and operate in complex and rapidly changing work environment helps me attain a good work-life balance, enjoy sports and travel with family..Areas of Expertise:- Etch process development and customer support (Plasma etch, wet etch of dielectric, metal materials) covering DRAM, 3D NAND and BEOL applications- Process development expert in Atomic layer deposition (metal/metal-oxide, nitrides/dielectric), atomic layer etching, RF Sputtering and Plasma-Enhanced CVD- Etch hardware troubleshooting, development, and installation- Etch recipe editor software development- Development of best known methodologies (BKM)- PM&D, Product Development and Release- Metrology skills: scanning electron microscopy (XSEM/CDSEM), optical emission spectroscopy (OES),Thin film thickness measurement , Defect analysis, Reflection high energy electron diffraction spectroscopy (RHEED), Fourier transform infra-red (FTIR) spectroscopy, X-ray Photoelectron spectroscopy (XPS), Auger spectroscopy (AES), mass spectroscopy, atomic force microscopy (AFM), Tunneling electron microscopy (TEM/STEM)- Customer management, project management, and team buildingI have 6 publications in leading scientific journals like Langmuir, ACS, JES and 6 published US/WO patents