Niko Holness Email & Phone Number

Los Angeles, Ca, Us

Torrance, California, United States

Redondo Beach, California, United States

Mechanical design engineer for R&D on minuaturized RF filters, isolators, and circulators • Conceptualization and design for manufacturing/assembly of 15+ designs• Oversaw fabrication of individual components • Data analysis• Documentation of Assembly/Manufacturing processesIntegrated Circuit Layout• Layout of 10+ photomasks• Coordinated section staffing for 8 months during management change• Trained and mentored new staffing• Increased staff efficiency in thin/thick film substrate process by 33% by minimizing miscommunication in handoffs• Oversaw assembly stress qualification testing for 3 circuit packaging technologies. Succesfully conducted Failure Analysis to diagnose cause of failure for one package type.

Printed Circuit Board Design• Design of 10+ PCBs• Coordination with electrical, thermal, manufacturing, and assembly teams• Onboarded new board vendor and created documentation to describe vendor's capabilities• Conducted design reviews• Trained and mentored new staffingIntegrated Circuit Layout• Layout of 5+ photomasks• Documentation of thin film substrates layout process• Data conversion

San Dimas, California, United States

Designed cooling system for the hot-end-cutoff-point of a manufacturing scale 3D printer.Problem: heat leakage from the hot end on an FDM 3D printer cause thermoplastic to melt above the heating body. The printer will spontaneously jam when the plastic melts too high and then cools back below its melting temperature since this region does not receive consistent heat.Tasks: • Researched cooling technology alternatives to fan cooling• Designed prototypes to execute the new cooling system• Designed and executed experiments to optimize the configuration of the new cooling system• Acquired Data through temperature sensors fed through an arduino serial interface and analyzed in python. • Iterated through designs until the maximum efficiency had been achieved• Compared to fan data and helped write a patent. Laid out and assembled the electronics enclosure for manufacturing scale 3D printer. • 30 unique components• Sourced additional hardware, assembled by hand