Nikolai Mäntyoja Email & Phone Number

Vantaa, Uusimaa, Finland

I play a key role in driving innovation in silicon wafer manufacturing through advanced product development and research. I specialize in power electronics, researching solutions for power management and high-voltage applications, which are a major part of our company's strategic focus.A significant part of my work involves managing external development projects with budgets up to €1M. One of my key achievements is successfully leading the Intelligent Reliability 4.0 (iRel40) project, which helped expand our capabilities in AI and machine learning.In addition to aligning new product offerings with strategic goals, I support our marketing department by translating complex technical concepts into clear, effective messaging. I also conduct internal training sessions to promote knowledge sharing and continuous learning across teams.My role combines technical expertise, strategic project management, and a commitment to fostering innovation at Okmetic.

Reviewer of deep tech and med tech startup applications in Seeds of Bravery (UASEEDs) project, which was funded by the European Union, under the European Innovation Council (EIC) and aimed at supporting the Ukrainian Tech Ecosystem. The goal was to strengthen Ukraine's tech landscape, supporting local entrepreneurs for global success.

Helsinki Metropolitan Area

The Lead System Designer role was more focused on the technology and overall performance/safety of the product family when compared to my previous Lead Engineer role which involved more project management. I successfully created a new overhauled requirement documentation for the whole product line and evaluated design risks related to user safety. As Lead System Designer, I had additional tasks, such as:▪️ensuring product compliance▪️ensuring product safety▪️evaluation of new technologies▪️product requirements and risk management▪️supporting stakeholders▪️data-analysis▪️supporting production lines

Vallila, Helsinki

I was a technical lead for a small team whose responsibility was the GE SpO2 sensors and cables. The team was responsible for both the full-scale product development and more straightforward product maintenance design changes. Lead Engineer -role was partially responsible for the project management. Therefore, I was in a central position to maintain the communication between different stakeholders such as QA, RA, Sourcing, Clinicians, and Supplier Quality. Moreover, the stakeholders and the team were spread across the globe which requires flexible teamwork. I collaborated closely with other parameter accessories teams such as EEG and ECG.Some of the typical daily tasks for our team were:▪️updating design outputs, requirements, drawings, and 3D-models▪️failure analysis of the customer returns▪️designing and implementing verification testing▪️designing and implementing validation testingAs Lead Engineer, I had some more specific tasks, such as:▪️product requirements and risk management▪️project management▪️supporting stakeholders▪️data-analysis▪️supporting production linesThe role required a deep knowledge of the relevant (medical) standards such as IEC60601 -series, ISO10993-1, ISO80601-2-6, and ISO13485. As a highlight, I spent lots of time working on the EU Medical Device Regulation (MDR).

Vantaa

In this role, I had the unique responsibility of managing both the Chip-to-Package and Package-to-Environment interfaces as a packaging design engineer. This required a broad understanding of various physical phenomena and the interdependence between the package, MEMS, and ASIC to ensure the overall functionality of the system. I worked seamlessly with diverse stakeholders to drive efficient product development in a cross-cultural work environment.My work in electronics packaging R&D was centered around design for reliability, FEM simulations, statistical analysis, 3D CAD design, reliability testing, and failure analysis. I focused particularly on addressing vibration and resonance challenges in harsh environments.Given that these products were destined for the automotive industry, achieving a ppm-level failure rate in high-volume production was critical. I gained hands-on experience with quality management systems (QMS) and automotive standards, including ISO 9000-series, IATF 16949, AEC-Q100, and AEC-Q200. Additionally, I became proficient in methodologies like FTA, RCA, 8D, DFMEA, PFMEA, and SPC.Through cross-team collaboration, I also developed a foundational understanding of signal processing, SQL, Lean, and Scrum. As an additional responsibility, I led a research project aimed at developing a new generation of electronics packaging (FO-WLP) to reduce both costs and the package footprint of the future product lines.

Finland

I worked in Electronics Integration and Reliability research group which was managed by Professor Mervi Paulasto-Kröckel. I participated in several projects, such as "Reliability Study of IGBT Module and Combined Loading Test of BGA Components" and "Power Amplifier Material and Structural Analysis". I acquired a plenty of experience working in a clean-room environment and became experienced in reliability testing. My role included planning, testing, sample preparation, characterization, data-analysis, and reporting of the results. Overall, the tasks were centered around:▪️Vibration testing▪️Cross-sectional analysis▪️Thermal cycling / thermal shock testing▪️Humidity testing▪️Drop testing▪️Electroplating▪️Lithography▪️Wet and dry etching▪️Atomic Layer Deposition (ALD)▪️Scanning Electron Microscopy (SEM)▪️Transmission Electron Microscopy (TEM) FIB sample preparation

Finland

I was a teaching assistant in the basic level physics for the first-year students. This role included traditional contact teaching and grading of the exams.

Finland

As a research assistant in the Department of Micro- and Nanosciences at Aalto University, I was part of a team working on optoelectronics projects. My main task was to study the behavior of Light Emitting Diodes (LEDs) at cryogenic temperatures, contributing to a specific research area within the group.Key responsibilities included:-Assisting in Research: I played a supporting role in our team's research on optoelectronics, particularly focusing on how LEDs operate in cryogenic conditions. My work involved setting up experiments and helping analyze the results.-Measurement and Data Collection: I conducted optical and electrical measurements, ensuring that the data gathered was accurate and reliable for further research.-Collaborating and Presenting: I worked closely with team members, learning from their expertise and contributing to our collective efforts. I also helped prepare our research for presentation at the ISGN-4 Conference in St. Petersburg and used this experience as the basis for my Bachelor's thesis.

Master Of Science (Ms), Electronics And Applications

Major: Electronics Integration and Reliability Minors: Micro-and Nanosciences, Product Development Thesis: Evaluation of Characterization.

Bachelor Of Science (Bs), Bionics

Major: Bionics Minor: Electronics Thesis: Optical and Electrical Properties of InGaN/GaN LEDs at Cryogenic Temperatures The studies.