Nio Cheng Email & Phone Number

Hello, my name is Nio Cheng, The following will briefly describe my study background and professional knowledge. Please advise, thank you.My hometown is in Tainan County, and the family education concept expects to develop a skill at a young age, so I chose the National Tainan industrial high school Mechanical Engineering to study and began to accumulate some basic professional knowledge related to the mechanism, mechanical principle, traditional mechanics and so on. In college, I entered the National Yunlin University of Science and Technology and majored in mechanical engineering. In addition to the compulsory subjects such as mechanics, mechanism, and automatic control, I also took electives such as computer-aided design, mechanical dynamics, and mechanical system design.The graduation thesis of the university is the actual action simulation of machine tools. The complete mechanical components are constructed by 3d drawing software (Solid Works, Pro/E), and integrated into a mechanical system, and then the computer is realized by the setting of the simulation software (ADAMS/View). Simulation of the operation of an automated mechanical system.My master's degree is from the Department of Materials and Optoelectronics Science, National Sun Yat-Sen University. In school, I chose the polymer field as my research direction and started taking related courses. The graduation thesis is the modification research of polymer, due to the properties of DNA (deoxyribonucleic acid), it is introduced into two incompatible polymers so that the side of the molecular chain has DNA functional groups and is transformed into a mutually compatible supramolecular structure, and research the properties of this polymer.Since working at Hsinchu ITRI, focus on the integrated development of novel packaging technologies and assembly processes such as Fan-out, 3D-IC, CiSP, etc. The individual main areas of expertise: # Compression/ Transfer molding process# Molding Compound material verification# Chip/Passive device embedded process# Flip-Chip bonding process# UV laser drill/hatch process# WLUF material verification# Active & Passive component embedded package.After accumulating the above work experience in recent years, I began to engage in related work such as process laboratory planning, process equipment evaluation and procurement, project management and planning, product process integration planning, and technology promotion. During my tenure, I have relevant experience as a seminar product analysis lecturer, and also can report projects to foreign customers.

Listed skills include Material Property Analysis, Semiconductor Packaging, and Process Doe Design And Discussion.

• 

  工程師

  工業技術研究院

  Sep 2009 - Present