SUMMARY PROFILE•A total of 7+ years experienced as Process Development Engineer with a demonstrated history of working in the semiconductors industry•Adept knowledge in Power Module Processes•Experienced in Process Engineering, Sustaining Engineering and New Production Introduction (NPI).•Skilled in power module packages Assembly from Front of Line to Back of End processes but not limited to Die Attach, Reflow, Encapsulation Process, Pin Insertion and Material Qualification. •Perform improvement project across the process involvement and ensure deployment across the plant and possibility to other processes.•Performs new Product/ Device qualification. (Robust, reliable, cost effective and industrial main assembly technologies); Ensure quality and Conformance to satisfy requirement.•Support New Materials Development and New Equipment Capability by performing process workability and needed documentation.•Ensure the quality compliance of new products, analyze, and identify root cause of the problems; recommend corrective actions; evaluate effectiveness of corrective action taken IN ORDER To achieve customer satisfaction.SKILLS HIGHLIGHTS•Product Introduction – Background in New Production Development from front line to back-end processes•Process Yield Improvement – Introduce systematic approach in order achieves customer targets and sustain through Continues Improvement Program.•Problem Solving & Decision Making- Introduce Planning, Implementing and identifying alternatives approach and function to solve the problem for customer satisfaction