Norbert Arnold Email & Phone Number

United States

Albany, New York, United States

MRAM functional characterization

Hopewell Junction, Ny

East Fishkill

14nm SOI FINFET eDRAM functional characterization

East Fishkill

22nm SOI eDRAM functional characterization14nm SOI FINFET eDRAM functional characterization

 Expansion of existing MST process capabilities of the Institute  Selection and acquisition of tools, managing investment budget Process control strategy Tool monitoring strategy Cleanroom planning Advice and support for users of the MST facilities

Overall Integration of Follower Products 300mm:• First Silicon: record time to test with yield above target. Highest score on internal success metric• Profitability: Elimination of overtesting increased yield on several products substantially

• Speed and overall yield improvement of DDR and DDR2 commodity products by driving process and test program changes via detailed correlations between test content and process parameters• Overall yield optimization for low power memory products: pinpointing of root causes for yield loss and driving improvements to ensure high margins• Product development (low power): in depth analysis of network currents unveiled process problems in specific circuits. Changes there lead to record low standby currents in the following product.• Product optimization: developed consistent temperature shmoo procedure for wafer and component test to optimize trimming of temperature sensor switch points

Team Lead "Vertical device DRAM Characterization; Process Spec Control" Characterization team lead, directing analysis tasks for various approaches to new cell conceptsEmergency process development support for critical process area to deliver first Silicon in timeTeam lead for unit process engineers to define and control process specification parameters

Team Lead "0.175 um / 0.150 um/0.135um Process Functional Analysis" Building and leading cross functional teams for all cutting edge development projects with IBM

Process Integration "0.175 um Deep Trench Technology Development Module owner" Directing process development in deep trench processing. Define process specifications and process control parameter ranges

Joint DRAM development project between IBM, Siemens, Toshiba. Team Lead "Quarter Micron Characterization"Leading cross-functional team comprised of members from all three partner companiesOrganizing Charaterization meeting in multicultural / multi-departmental environmentEvaluation of process experiments for the development of the most successful DRAM memory cellInitiating of failure analysis and follow up with process change plansFeedback to various departments about failure mechanisms and process marginalities Norbert Arnold, PhD resume., pg. 2

GaAs Electronic, Project Leader "Process Integration for Low Noise High Electron Mobility Transistors and MMICs" Design of GaAs/AlGaAs heterostructures for low noise devicesTest structure layout and device characterization

GaAs Electronic, Project Leader "Process Integration for GaAs Power Microwave Monolithic ICs", joint project between Siemens R&D and Siemens HL EH production.Power MESFET design and characterizationLayout of power MMIC test structures for process characterization and microwave analysisLeading joint development team across company divisions

GaAs Electronic, Head Dry Processing DevelopmentMultivariable Design of Experiments to optimize various deposition and etch processesIntroduction of extensive process characterization and control methods into the departmentProcessing tool selection, acquisition and installationDry processing Team lead in international European development project

Phd, Semiconductor Technology

Research project: Solid source diffusion in GaAs for microwave MESFET devices (PhD Thesis) Together with other PhD students.

Diploma, Physics

Conductivity in amorphous semiconductors Design of deposition and insitu characterization methods for amorphous Si and Ge