Instruments I am qualified to operate at University of California, Berkeley: Berkeley Marvell NanoLab, University of California, Berkeleyo Plasma Enhanced Chemical Vapor Deposition (Oxford2): Silicon Nitride & Silicon Oxide o Deep Reactive Ion Etch (STS2): Silicon etch using the BOSCH process o Inductive Coupled Plasma Etch (Centura MxP+): Etch Silicon Nitride & Silicon Oxide o Silicon wafer Dicing (DISCOS DAD3240): Dicing up to 8” Silicon wafer

Project Experience: Silicon n-channel MOSFET device fabrication TCAD simulation: Winter 2018o Device fabrication process simulation: Silicon n-channel MOSFET (p-type body, 100 nm gate-length) using TCAD (TSUPREM4)Silicon n-channel MOSFET device performance TCAD simulation: Spring 2018o By changing the thickness of the epitaxial layer in NMOS, we modeled a theoretical profile between the impurity concentration and threshold voltage. For the thickness between 40 nm ~ 60 nm, we obtained stable threshold voltage values, less independent on impurity concentrationGraphene Field‐Effect Transistors: Device Fabrication Summer 2017 – Spring 2018o Mono-layer graphene film synthesized on thin copper foil from methane using chemical vapor deposition process o Graphene field-effect transistors fabrication process flow: critical cleaning, graphene and hexagonal boron nitride film transfer using wet etching, electrode patterning, lift-off, channel patterning, chip isolation, annealing Graphene Field‐Effect Transistors: Device Characterization Summer 2017 – Fall 2018o Contact resistance with Schottky barrier analyzed between graphene and metal contact in different gate biasing conditiono Device capacitance-voltage (CV) characteristics measured at different applied frequency: like conventional MOSFET, graphene field-effect transistors exhibit a similar response in the higher frequency domain

Teaching Assistant:MSE 510: Microsystem design, fabrication, and test lab (Cleanroom FAB) (Supervisor: Dr. A Radadia)PHYS 261 & 262: General Physics Laboratory (Supervisor: Dr. John Shaw)ELEN 334: Solid State Electronics (Supervisor: Dr. Sandra Zivanovic)NSE 302: Nanomanufacturing (Supervisor: Dr. A Radadia)ELEN 242: Introduction To Microprocessors (Supervisor: Dr. Davis Harbour)

o Course instructor: device layout and microfabrication process flow design, feasibility analysis, process documentation, process development and demonstration, fabrication characterization in metrology, device electrical characterization

Student instructor for the following metrology tools/instruments: mentoring new users on operational principles: o Film thickness: Ellipsometer (SE 850) o Thin-Film Analyzer (FILMETRICS® F10RT) o Stylus Surface Profiler (Dektak 150)o Scanning Electron Microscope w/ EDS (HITACHI® S-4800 field-emission) o Atomic Force Microscope (Agilent 5420) o Optical Microscope (Leica DM4000 M, OLYMPUS Vanox AHMT3) o 3D Confocal Microscope (VK-X250, Keyence®) o Raman Spectroscopy (HORIBA Scientific XploR PLUS) Supervisor: Mr. Phillip ChapmanEngineerDepartment of Material Science & Engineering - Materials Characterization and ProcessingJohns Hopkins UniversityEx-Associate Director of OperationsInstitute for MicromanufacturingLouisiana Tech University

Time Period: April 24, 2017, to April 28, 2017 (One week)Instrument: Cypher North Scanning Probe Microscopy, Asylum Research InstrumentTraining Topics: AC mode imaging on graphene surface Scanning Kelvin Probe Microscopy (SKPM) for potential distribution of surface Local Oxidation Nanolithography on graphene surface (Contact mode)Supervisor: Liam CollinsPost-Doctoral Research Associate Oak Ridge National LaboratoryOak Ridge, TN

• Conducting technical research/analysis on regulatory best practices (Telecom Act, National policies, directives, guidelines) and approach to the regulator to get favorable outcomes for the business• Planning and pricing of spectrum.• Ensuring timely payment of spectrum price, license fee, revenue sharing, and interconnection charge.• Providing support to all the functional teams (Technology, Finance and Market Operation) from regulatory point of view to achieve business objectives.• Building, managing and maintaining strategic relationships with the external stakeholders (Regulators,Government bodies, other operators)• Analysing regulatory risk of the enterprise in assistance with the Group Regulatory.• To be aligned with regulatory compliance to ensure smooth business operation.• Keeping knowledge on latest regulatory developments and reporting to Group Regulatory/Corporate office.