- Product and technology development in the areas of MEMS based thermal management devices, 3D lithography and metal additive manufacturing for semiconductor test equipment. Driving system architecture development, microfabrication and process development. - Technology roadmap and development of new process capabilities to address new markets in the areas of sensors, thermal management and semiconductor testing. - Customer management, team building, vendor and supply chain management.

- Led development effort of MEMS gas sensors for high sensitivity and selectivity applications. - Built and managed advanced development program, product architecture and technology roadmap.- Managed multidisciplinary development effort and cross-functional teams responsible for materials development and characterization, transducer and MEMS process development, packaging, analog/digital electronics, sensing algorithm development, sensor hardware integration and firmware development, calibration test protocol and spec validation tests.

- Reporting to CTO, created and managed a program to develop carbon nanotube based electromechanical probes for future generation contact probe springs. Led the project from the idea/concept stage to the prototype stage. Shipped the world’s smallest pitch probe card using the new technology. - Demonstrated feasibility of a probing solution to test TSV Devices by direct connection of Micro-bumps at 40µm pitch for 3-D IC stacking/integration. - Cultivated research and development partners with industrial and university technical leaders to solve challenging problems. Examples include development of novel laser micromachining and thin film deposition techniques for carbon nanotube based structures. Developed architecture and infrastructure to interface new spring designs with probe cards for various pitch and space transformation requirements including specialty substrates. Successfully developed a silicon interposer for small pitch probing applications. - Generated IP on core technology of CNT fabrication, metallization and packaging, including Fuel Cell applications.

Synthesis and Investigation of Mechanical Properties of Multi-walled Carbon Nanotube Assemblies

Classes taught: Introduction to MEMS, Mechanics, Design and Robotics

Product Development

Developed pricing strategy for a telecommunications startup company.

Fabrication, process development and characterization of RF MEMS and high-Q microsystems for communication systems in cars.

Modeling, Simulation and Design of MEMS devices. Investigation of the effects of circuit design on efficiency of piezoelectric power generation.