Param Aulakh Email & Phone Number

United States

SUMMARY OF QUALIFICATIONS:Over 20 years experience in the high tech manufacturing environment.Excellent organizational, written & verbal communication skills.Extremely motivated, conscientious, hard working, quick learner & effective communicator, dependable & reliable. Ability to work in multi-task environment.Self-starter with ability to work under minimum/limited directions.WESTERN DIGITAL / READ RITE​ FREMONT, CA​ Sep. 00 – PresentSr. Plating and Etch Engineering Tech.• Extensive responsibilities of Plating/Etch stations areas using guidelines & process specification in manufacturing of wafers.• Disposition of wafers on engineering hold for process related problem.Qualifying the latest automated plating equipments like Tosetz & Amerimade. Keep control of SPC & responsible for daily presentation in engineering morning meeting.• Certified to change & set up new recipes for plating, etch & Tencor measurements systems.• Perform all qualified tests on all plating/etch/strip systems after maintenance or if any out-of-control process condition occurs.• Conduct brush check & adjustments on 13 SSEC (RESIST STRIP/LO) tools weekly. Maintain & update SPC data base on regular basis.• Carry out engineering DOE execution & data collection.• Instruct, audit & train all production personnel in proper safety procedures and regulations.• Interfaced with engineering staff to implement new technology. • Interact with engineering staff in qualifying & implementing new processes. HEADWAY TECHNOLOGIES INC.​MILPITAS, CA.​Mar. 97 – Sept. 00 Plating Engineering Tech:• Disposition of wafers on engineering hold for process related problems.•Cross trained & certified new operators by using guidelines & process specification in mfg.• Wrote specs with the help of engineers for the manufacturing team & implement on line..Certified to run all plating/etch stations which included nickel, cu/coil, Au plating, AP/EDTA, Field etch, strip& measurements tools.

United States

Playing / Etch Process Engineer Technician HEADWAY TECHNOLOGIES INC.​MILPITAS, CA.​Mar. 97 – Sept. 00 Plating Engineering Tech:• Disposition of wafers on engineering hold for process related problems.• Cross trained & certified new operators by using guidelines & process specification in mfg.• Coordinated with engineers in doing qualifications of equipments, new process & new fixtures used in plating area.• Wrote specs with the help of engineers for the manufacturing team & implement on line.• Certified to run all plating/etch stations which included nickel, cu/coil, Au plating, AP/EDTA, Field etch, strip stations & Tencor measurements tools.