Eng Tech
Current- SUMMARY OF QUALIFICATIONS:Over 20 years experience in the high tech manufacturing environment.Excellent organizational, written & verbal communication skills.Extremely motivated, conscientious, hard working, quick.
- Extensive responsibilities of Plating/Etch stations areas using guidelines & process specification in manufacturing of wafers.
- Disposition of wafers on engineering hold for process related problem.Qualifying the latest automated plating equipments like Tosetz & Amerimade. Keep control of SPC & responsible for daily presentation in engineering.
- Certified to change & set up new recipes for plating, etch & Tencor measurements systems.
- Perform all qualified tests on all plating/etch/strip systems after maintenance or if any out-of-control process condition occurs.
- Conduct brush check & adjustments on 13 SSEC (RESIST STRIP/LO) tools weekly. Maintain & update SPC data base on regular basis.