Parshant Kumar Email & Phone Number

Lowell, Ma, Us

Cambridge, Ma, Us

• Micro and Nanofabrication and Testing of Micro/Nano system• III-V based HEMT and MEMS • Developed processes for Si/diamond/polymer-based semiconductors and MEMS/BioMEMS devices • Si-based radiation hard and reliable ICs and Microsystem • Diamond based gyroscope - MRIG DARPA program • GaN-based amplifier • Metal, Silicone, and Polyurethane based climbing system (DARPA program) –From prototype to Production - Low-rate production at Draper -One Patent • Optical Neuro probes (DAPRA)- 50 um diameter and 3 mm long fibers on the wafer and released from wafer to be flexible for the red and blue light to stimulate neuron and communication - patent pending • Wireless stimulation of neurons using 1.2 mm x 0.5 mm particle size device -Developed and low rate production for American heart association for clinical trial • PDOT based Organic transistor for drug detection - Design, developed and tested -patent pending • Carbon nanotube-based devices and research - growth, purification, transistors, MEMS, interconnects and devices and Process: Spray coated CNTs antenna on paper and glass substrate as X-rays transparent antenna for SOCOM• MRNA: Developed BeTe thermoelectric based energy harvester for space applications -DARPA program • Anti-Temper Solution Development – Product-specific as well general chemically amplified solution to defeat FIB attacks for reverse engineering solutions• Supply Chain Hardware Integrity for Electronics Defense (SHIELD)- DARPA -Mechanical fragility added to the CMOS devices to protect the electronics -a collaboration with NRL and Nrothgrumann • Analytical modeling of rf devices and MEMS TCAD ( Silvaco and Synopsis) for physics device simulation and Pathwave -Advance Design system for electrical simulations for performance evaluation • Project/ program and People management experience • Writing proposals and doing Business developmentUnderstanding the quantum computers and computing R&D Mentor, influencer, invemtor

DARPA Nano Electro-Mechanical System for Signal Processing Program to develop rf filter based on III-V materials Design and fabrication of AlGaAs based rf piezoelectric MEMS and HEMTs ICs Si and III-V MEMS development, Si and Polymer-based microfluidic system and Si nanostructures development for low volume sample analysis.Program Dettails from DARPA release NanoMechanical Array Signal Processors (NMASP)The NMASP program[4] aims at creating arrays of precision,nanomechanical structures (Figure 3) for RF-signal processingthat will achieve:• >100X reduction in size (from 80 cm2 to 0.8 cm2 or smaller),• >100X reduction in power consumption (from 300 mWto less than 3 mW during receive, and from 30 mW to <0.3 mW during standby, compared to current cellphones), and• >10X improvement in RF performance (spectral efficiency and bandwidth). The development of nanomechanical array signal processors will enable ultra miniaturized (wristwatch or hearing aid in size) and ultra low power UHF communicators/GPS receivers which will greatly improve the mobility and location identification of individual warfighters. They can also be used for miniaturization and integration of stand-alone, self-contained, wireless microsensors and microactuators that can be deployed remotely in clusters to drastically enhance superiority of weapon systems and field awareness. Other potential uses for military applications include an ultra portable spectrum analyzer, Fourier signal-transformer, programmable equalizer, frequency converter, parametric amplifier, and other UHF signalprocessing equipment.Core NMASP technologies can also be used for mass spect ro m e t e r, calorimeter, bolometer†, and high-resolution IR imager applications. All of these NMASP applications will be c h a r a c t e r i zed by significant power reduction and/or ultra miniaturization while meeting or exceeding the performance levels of the state-of-practice approaches. T

Development of Micro system for Nano free patterning of metal nano patterns for interconenects and Biosensors. MEMS device on top of membrane with nano pattern in it to free writing of metal nano patterns usign MEMS devices

Developed Atomospheric plasma ashers III-V MEMS

Integration of MEMS device to the beam metal deposition system for random metal nanopatterning.

Ph D, Microelectronics - Applied Physics

Oracle Certified Professional

Post Graduate Diploma, Computer Engineering

High Temperature Super Conductors, Solar Cells, And Bio Electronics

Master Of Science - Ms, Solid Sate Electronics

B. Sc., Maths, Physics, And Chemistry