- Partnership development- Innovation funding- Definition and implementation of technology maturity level process

- Management of the team developing new Front End and Back End technologies for infrared sensors- Management of partnerships with R&D entities

- Management of the team developing new Front End technologies for infrared sensors- Management of partnerships with R&D entities

-Acted as a consultant for the tunable laser manufacturing line-Led the quality improvement project of a tunable laser chip with integrated modulator

-Managed front-end manufacturing of tunable laser product line (20 people) providing multi-million dollar sales per quarter.-Successfully transferred Santa Barbara process know-how to new team for relocation of manufacturing front-end.

-Implemented an organometallic cost reduction plan that resulted in $40,000 annual savings.-Invented process allowing for reliability of ridge tunable-laser chips to meet Telecordia requirements (patent pending).-Transferred base epitaxy and regrowth process from development to production.-Initiated and executed product improvement plan with substrate supplier that produced a yield improvement of 30 %.-Adapted MOCVD team staffing to quickly changing capacity requirements of the industry.-Managed and achieved outsourcing of base epitaxy wafers to a European supplier.-Chaired safety committee, insuring training and safety inspection stayed current and compliant.

-Initiated MOCVD at Agility: specified MOCVD system and characterization tools.-Delivered advanced material within 1 month of MOCVD system start up.

-Developed MOCVD material growth process for world record performing avalanche photodiodes, vertical cavity surface emitting lasers (VCSEL), electro-absorption modulators and optical switches.