Patrick B. Email & Phone Number

United States

Plainview, New York, United States

Rochester, New York, United States

- Performed electro-optical characterization such as quantum efficiency and angular response- Executed permutation and power measurements tests- Wrote technical reports for scientific audience and provided actionable input for datasheets- Developed test routines using Python- FPGA Coding with Xilinx Vivado for I2C communication- Ran cycled thermal testing.

- Pioneered production test of new family of image sensors on Teradyne IP750EX IG-XL tester- Engaged domestic and international team members to solve product and test problems- Provided test subcontractors with image sensor technical expertise- Performed product debug and characterization- Specified test hardware- Managed and performed test correlations.

- Led multi-company technical team in design and implementation of novel semiconductor waferprobing tester. Outlined the hardware, software, mechanical and infrastructural requirementsof tester- Developed and commissioned first generation wafer test system; the success of which was akey decision factor in pursuing the next generation tester- Led test.

- Responsible for CMOS imager characterization- Built full 12-inch probe and final test system from scratch- Probe card harware design- Performed maintenance and additions to legacy wafer test systems- Acted as a Field Applications Engineer for other test systems installed at customer locations- Imager failure analysis- Integrated circuit design with.

- Characterization of megapixel CMOS imagers- Design of engineering test platforms- Creation of production test systems- Integrated circuit design and DFT- Applications engineering- IT site manager

Master Of Engineering - Meng, Electrical And Electronics Engineering

Bachelor Of Engineering - Be, Electrical And Electronics Engineering