Patrick Irwin Email & Phone Number

Process Engineer specialising in automated encapsulation and underfill for printed circuit board assemblies (PCBAs) and power semiconductor devices. Extensive experience developing novel processes and improving existing processes for medical implantables and other complex, high-value devices.Graduated from the University of Birmingham in 2021, earning First Class Honours (4.25 GPA) in my MEng Mechanical Engineering course. My studies included a 13-month internship with BMW Manufacturing UK at Plant Oxford. Feedback from my industrial supervisor described me as “dependable, conscientious, focused and quality driven. While being a team member, respected and well liked."Prizes and Awards:Petro-Forge Prize (2021) - Annual award for a Final Year Project demonstrating “outstandingcreative capacity”.Thomas and Elizabeth Williams Scholarship (2020) - Grant awarded for final year at university.Stephen Hayes Prize (2017) - Awarded by the School of Mechanical Engineering at the Universityof Birmingham for “the highest scoring overall work in a field in which computing plays amajor part”.

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  University Of Birmingham

  First Class Honours (4.25 Gpa)