Patrick Le Bihan Email & Phone Number

France

Managing Memory Solutions Ecosystem Team on a Worldwide basis.- Ecosystem engagement and alignment for all Memory Solutions products (NOR Flash, Semper Flash, HyperFlash & HyperRAM, nvSRAM & FRAM, Synchronous SRAM, Asynchronous SRAM, Timings products)

France

Led Cypress Ecosystem Team on a Worldwide basis for all Market Segments with:- All Cypress Memory products (NOR Flash, NAND Flash, Managed NAND, HyperFlash & HyperRAM, nvSRAM & FRAM, Synchronous SRAM, Asynchronous SRAM), Timing Products (from March 2015 to April 2020)- USB products, Bluetooth Low Energy products, PSoC MCU for System Management & Control applications (from March 2015 to December 2016)Direct report: 5 people (Asia, USA)• Defined Ecosystem Marketing team priorities and strategy in line with respective Cypress Business Units and Corporate objectives • Global WW Ecosystem Accounts (over 100) Coordination and Engagement strategy• Drove Go-To-Market Activities (joint Press-Release, joint-demo at Trade Shows, collaterals development, chipset pairing guide...) and alignment with Ecosystem Partners• Achieved 85% Market Share for Cypress NOR Flash at Automotive ADAS Chipset & Reference Design Manufacturers • Achieved Preferred NOR Flash Memory supplier status at 8 of the Top-10 Chipset Partners• The team achieved multiple Reference Design Qualifications for Cypress products other than Flash Memories in the 1st year, leading to several M$ revenues at end-customers

France

Led Spansion Ecosystem Marketing team in Memory Division on a Worldwide basis for all Embedded Market Segments- Team of 5.5 people spread across the globe (Asia, US, Europe)• Defined Ecosystem Marketing team priorities and engagements in line with Spansion Corporate targets and Product Marketing team objectives• Global WW Ecosystem Accounts (over 100) Coordination and Engagement strategy• Enabled adoption and incorporation of Spansion New Memory Interface, HyperBus™ by a wide range of Chipset Partners especially in Automotive. This resulted in the fastest new memory interface adoption in the history of Spansion• Created new processes which resulted in greater revenues for Spansion and higher number of design wins at end-customers.• Received Spansion Award at Spansion’s Leadership Summit 2014

Issy-Les-Moulineaux, France

Led Ecosystem Development and Engagement in EMEA within all Embedded Markets (STB, Automotive, Consumer, Industrial, Networking, Telecommunications) and Wireless & M2M Markets• Advanced Architectural and Product Definition Engagement with Ecosystem Partners, Memory IP Controller 3rd Party and Customers • Reference Design Wins at Chipset Partners• Developed collaterals detailing Qualified Spansion Flash per Chipset Partner MCU / SoC to help Sales get Design Wins at end-customers• Business Development• Expanded STB Ecosystem Coverage with Conditional Access Suppliers resulting in successful definition and development of a new Secure NAND Flash Family to address their requirements

Levallois-Perret, France

Part of a WW core group responsible for driving all new Spansion product Definition & Concepts and Ecosystem Alignment• Product Planning, Product Proposal, Datasheets and Specifications development • Wireless Market Analysis: survey of Market trends and Architecture evolution, and folding back those trends into Strategic Product Planning. • Evangelization of new Product features, Architecture & Interface to Architects of all wireless Chipset Manufacturers on a WW basis, all EMEA Handset Manufacturers and Standardization Committees (JEDEC, OMTP, MIPI…)• TAM/SAM/SOM Analysis for new products; identification of key partners and targeted end-customers; ROI analysis; Roadmap Creation• MarCom Engagement: Joint Press-Release with key partners; Presentations at Trade Shows; Development of Joint Collaterals and documentations• Entirely defined a new Flash family for Ultra-Low Cost (ULC) Handsets: Product Definition, datasheet writing, TAM/SAM/SOM, ROI Analysis and Engagement Plan - this Flash family generated 100s millions of units at end-customers• Part of the team who defined LP-DDR2 NVM • Developed engagement with Wireless Operators resulting in becoming Preferred Flash Supplier of a major Operator for its own-branded Handsets.

Orly, France

• Business Development and Pre-Design Activities through proactive work with Ecosystem, ODM and End-Customers.---> Created from scratch the relationships and engagement strategy with Chipset Partners enabling compliancy of respective products, ensuring successful product definition and facilitating Sales design-win activities at end-customers.• Managing Memory Product Positioning in EMEA through presentations at Conferences, Trade Shows, Press Activities and discussions with Analysts.---> With MarCom team, I generated more than 50 positive articles in press (magazines, electronic publications, financial dailies...) across Europe and participated in press Launches• Provided feedback of Technical trends, advanced architecture and Inputs for future Flash Memory product definition.Received AMD Award for Marketing Significant contribution to Sales at AMD’s Sales Conference 2004

Orly, France

FAE for France / Benelux/ South Europe for all the non-PC related AMD Products: Flash memory, Embedded Microprocessors, Telecom Products.• Design-In Activities, customer Technical Support and guidance• Pre-Sales, Post-Sales support• Distribution Technical & Marketing Training, support, joint-customer visits, design review.Handled the Top-3 Wireless Handset Manufacturers in South-Europe including AMD’s largest Wireless customer WW.• Grew at one customer, Flash Memory revenues from few Million $ to close to 100M$ per year and increased Flash Market Share from 30% to 100%, making it the 2nd largest AMD Wireless customer WW.• Instrumental in having AMD to develop its first MCP products • Design-Win of two AMD Flash Product at Tier-1 Wireless customers which were the only ones on a WW basisHandled AMD’s 2nd largest Embedded customer WW and achieved Design Win of AMD Embedded Processor in a Multi-Million $ projectsReceived AMD Award for Best FAE at AMD’s Sales Conference 2001

Corbeilles-Essones, France

Held various positions at IBM Microelectronics R&D Laboratory: initially in an Internship (1 year from August 1996 to August 1997, then 6 month: January 1998 to June 1998) then as ASIC Designer and finally as ASIC Team leader.Worked on several versions (initial ASIC Development, shrink, enhanced version) of a Telecom ASIC: SONET/SDH with ATM Transport- Involved in all various aspects of ASIC Design: Creation and Development of the ASIC Test Environment (System C and VHDL), Development of test coverage plan and test case suite, ASIC Simulation and Analysis, Validation, bug tracking and correction, Architecture Definition and Implementation in VHDL, Timing Analysis & Floor-Planning, ASIC Bring-Up, Hardware Evaluation and Debug of the final silicon in customer premises in Israel during 1 month- Completed validation of the Silicon 1 month earlier than the customer expectations

Master Of Science, Specialization In Microelectronics (Asic Architecture Conception)

Activities and Societies: Junior Entreprise Gala ESIEE: 2nd largest Gala in France in 1995

3-Month Internship

Activities and Societies: Developed interface on MS Visual Basic for Histopathologist

Baccalaureat C With Distinctions, Mathematic And Physics