Sr Principal Application Engineer and Consultant, I possess a unique combination of software and design skills in the co-design of SiP (System In Package) and globally IC/Package/Board system co-design and analysis.Commited to customer success, i am involved as consultant for the major IC customers, expert in SIP working on the implementation of leading edge technologies like 3D embedded components and 3D TSV, involved on European and worldwide projectsI have strong analysis capabilities in the system process optimization and integration in MCAD/ECAD/3D design and simulation environments. My experience in both electronic design and analysis (as well as programming) provides the ability to effectively deal with the complex problems encountered in RF/Digital system architecture.I provide my expertise on interconnects and related RF and high speed signal transmission, power distribution networks, EMC/EMI, Thermal simulations and DFM for SIP. Manager previously of an engineering team I create and put in place all the foundation of the Cadence MSWares for quickly developing new tools and design flow for design and process optimization for worldwide customers.Specialties: • Consulting and team coaching in high end SIP technologies and service solutions to customers• Expert on SiP (System in Package) co-design within the IC RF/Digital flows• Process optimization, SI, PI, EMC/EMI, Thermal analysis, DFM, 3D MCAD/ECAD integration•3D MCAD/ECAD co-design and simulation (mechanical/electrical/thermal environment)• Project Management• Architecture and development of applications for process optimization.• Tools: All the Cadence Platforms (APD/ SiP ...), 3D EM FS from Sigrity and Cadence, Virtuoso (Composer / Layout)/Voltus, SoC Encounter/EDI/Innovus)