Patrick Harris Email & Phone Number

Chicago, Illinois, US

Manage day-to-day operations for a product design and development company that provides services to people with new products and patent firms. We offer the following services: -Product Development Consultation -Schematic Capture and PCB Layout -Computer Aided Modeling (CAD) -Photo-Realistic Rendering -Patent Drawings -Computer Animations -Physical.

Kalamazoo, MI, US

• Provide resolution to in circuit test fixtures in manufacturing. These test fixtures evaluate the performance of bone drilling instruments, bone cutting instruments, and a hygienic vacuum system (Neptune).
• Develop test procedures to return test fixtures back to production in a validated state.
• Generate and review LabView code for post-launch ATE (Automated Test Equipment) test fixtures

• Responsible for performing risk assessment on electronic/electrical components used in medication delivery systems (IVs).
• Work on electrical/electronic component obsolescence and component engineering issues.
• Perform component specification comparison and analysis.
• Conduct technical design reviews for electronic/electrical components changes.
• Prepare and conduct electronic/electrical sub-assembly studies and test.
• Work on field investigation and field reported non conformance issues.

• Responsible for Electromagnetic Compatibility (EMC) testing of 90 kVA EPGS Electric Power Generation System used on Boeing 737 aircraft. High Power Electric system for commercial aircraft.
• These tests are performed on the 737 EPGS in which 3 boards in the Generator Control Unit (GCU) and 3 boards in the Bus Power Control Unit (BPCU) have been redesigned to demonstrate compliance with the EMC.
• Perform RF Radiated Emissions (RE) on both horizontal and vertical polarities using Active Rod, Biconical, Dipole, and Horn antennas to establish worst case emissions from the redesigned GCU and BPCU units and its.
• Perform RF Broadband and Narrowband Conducted Emissions (CE) test on all power lines. Evaluated compliance with limit specifications.

• Contract Engineer for medical imaging equipment (MI-Molecular Imaging). Troubleshoot defective digital/analog/mixed signal circuit boards that have been returned from the field. Reported findings and provide corrective.
• Performed Electromagnetic Compatibility Testing (Radiated Emissions) and Thermal Testing for system power supplies.
• Identified replacements for digital/analog obsolete parts. Generated and processed Engineering Change Orders (ECOs).

• Contract Engineer for medical imaging equipment (MRI-Magnetic Resonance Imaging). Resolved digital/analog/mixed signal hardware engineering issues that occur for products that are in production or are no longer.
• Developed test procedures and performed testing on various circuits board boards from (MRI-Magnetic Resonance Imaging) systems. Documented and analyzed test results.
• Presented design changes to the Change Review Board. Processed and documented changes through ECO Engineering Change Order process. Training: Design Controls-Design Inputs, Design Outputs, Design Transfer.

• Contract Test Engineer for UHF/VHF (RF/analog) pubic safety two-way radio handsets/headsets. Performed Electromagnetic Immunity (EMI) testing to ensure compliance to EMI specifications/requirements.
• Developed test procedures to ensure all applicable functions and modes were exercised during testing.
• Built RF/Electrical test fixtures and cable assemblies for compliance testing in GTEM chamber (EMI Test Chamber).
• Provided feedback and solutions to compliance failures through root-cause analysis.

• Contract Test Engineer for QUAD PAs (Power Amplifiers)-a 350 Watt 900 MHz (RF/analog) power amplifiers for NEXTEL iDEN Cellular Base Stations. Responsible for test and evaluation of QUAD PAs against customer.
• Performed worst case test and evaluation and verified (RF/analog) power amplifiers design met performance requirements across all operating conditions.
• Developed LabView programs for test automation (ATE/GPIB).
• Evaluated new RF/analog component performance in QUAD PAs.

• Contract Development Team member in which responsibilities included design and layout of high digital speed multi-layer PCB (Printed Circuit Board) connector test boards using P-CAD.
• Generated gerber and manufacturing files for PCB fabrication. Lead design reviews for Printed Circuit Board (PCB) release approval.
• Interfaced with PCB manufactures to resolve fabrication issues.

• Product Development Team member in which responsibilities included design and testing RF/analog/digital Network Access Devices (NAD) for the ONSTAR GPS system in General Motor(GM) vehicles.
• Performed testing, validation, and implementation of new components used on NADs.
• Provided MOL (Maintenance of Line) support to manufacturing (Nogales, Mexico).

• Development Team member in which responsibilities included design and testing high speed digital fiber optic transceivers. Data Rates include: 2.125 GB/s, 1.125 GB/s, 1.063 GB/s.
• Conducted trade-off and design-to-cost studies for optical transceivers.
• Utilized P-CAD in preparing schematic diagrams and multi-layer printed circuit board (PCB) layouts.
• Evaluated optical transceivers using Agilent Digital Communication Analyzer (DCA) and Bit Error Rate Testers (BER).
• Extensive interface with component suppliers and PCB manufactures.

• Integrated Product Team member in which responsibilities included RF/analog/digital hardware design, system analysis, simulation, and circuit testing of AMRAAM (Advanced Medium Range Air-to-Air Missile) Receiver.
• Utilized PSPICE software tool to conduct trade-off, design-to-cost, component stress/reliability, Monte Carlo, worst case, and sensitivity studies for AMRAAM Receiver.
• Directed product designers/drafters in preparing schematic diagrams and printed circuit board (PCB) drawings.
• Interfaced with vendors for component selection.

M.S., Electrical Engineering

B.S., Electrical Engineering