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High energy, data driven, results oriented Engineering Executive with over 25 years of experience in research, development and commercial launch of Augmented Reality products, wafer level optics, and mobile phones. Technically savvy leader with strong business acumen. Proven track record of delivering innovative products to market, driving new technology development, and leading cross-functional teams. Exceptional communication and collaboration skills practiced at all levels of the organization.
Meta
View- Website:
- metadownhole.com
- Employees:
- 5
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Vp Wearables Hardware EngineeringMetaSunnyvale, Ca, Us -
Vp Ar Hardware EngineeringMeta Jan 2024 - PresentMenlo Park, Ca, Us -
Vice President Hardware EngineeringGoogle Jun 2021 - Jan 2024Mountain View, Ca, UsResponsible for the research and development of Augmented Reality and Wearables hardware -
Chief Technology Officer / Svp Platform EngineeringMagic Leap Mar 2020 - Jun 2021Plantation, Florida, UsPlatform engineering leader responsible for research & development for Magic Leap’s portfolio of immersive Augmented Reality products • Developed product and technology roadmaps for future generation Augmented Reality devices aligned with user needs • Led the research & development for Magic Leap’s second generation product (Magic Leap 2) from product definition through development verification testing. Magic Leap 2 improved user KPI’s for image quality, field of view (2x), compute (3x), registration of digital content to the real world, and power in a form factor that is half the size of the first generation product.• Instilled an engineering culture of innovation where the ‘impossible’ was viewed as ‘just another hard engineering problem’• Responsibilities included hardware, software, & systems engineering, product management, technical program management, supply chain and internal manufacturing operations. • Promoted to Chief Technology Officer in October 2020 -
Senior Vice President Hardware Engineering And ProgramsMagic Leap Feb 2013 - Mar 2020Plantation, Florida, UsLed hardware and systems research and development for Magic Leap’s portfolio of immersive Augmented Reality computing products• First engineering executive and 19th company employee• Built a world-class hardware, manufacturing operations and supply chain team from 6 to > 500 engineers• Instilled a culture of innovation and implemented industry best practices, tools, and metrics• Developed and implemented an AGILE hardware methodology to rapidly explore technology paths and achieve world class product development cycle times• Championed the development of a novel waveguide fabrication line and led internal manufacturing operations• Led the product program execution (hardware and software) for Magic Leap One [2018 Launch]• Directly responsible for systems, optical, electrical, and mechanical engineering; manufacturing operations, supply chain, and technical program management -
Vice President Of EngineeringTessera (Digital Optics) Jun 2010 - Feb 2013Led the product and process development of innovative wafer level optics • Delivered diffractive and refractive components and assemblies for visible & infra-red cameras, laser projectors, depth sensors, MEMS autofocus cameras, and waveguides• Successfully developed, launched, and licensed the industry’s first 3MP wafer level camera module• Developed an IR lens fabrication process and achieved exceptional process capability
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Director Of EngineeringMotorola - Mobile Devices May 2008 - May 2010Chicago, Illinois, UsLed a product development organization known for delivering innovative hardware for mobile phones on time, below cost, and with exceptional quality. Developed product concepts, integrated new technologies, created and executed program plans, defined hardware architecture, verified product performance, achieved manufacturing quality targets, and delivered robust products to market on-time. • Successfully launched over 20 mobile handsets including the Q9h, RAZR2 V9, and Z9 • Led the system level integration of the micro USB connector and accessory platform for the corporation• Hardware platform architect for Motorola’s i30, i35, i60, i85, i90, i95, i730, and i1000 -
EngineeringMotorola - Mobile Devices May 1994 - Apr 2008Chicago, Illinois, UsSenior Resource Manager ~4/2004 - 5/2008Distinguished Member of the Technical Staff ~ 4/2000 – 4/2004Principle Engineer ~ 10/1998 – 4/2000Lead Mechanical Engineer ~ 6/1996 – 10/1998Senior Mechanical Engineer ~ 6/1995 – 6/1996Mechanical Engineer ~ 5/1994 – 6/1995 -
Mechanical Design EngineerGeneral Dynamics Sep 1989 - May 1994Reston, Virginia, UsProvided design and production support for complex mechanical systems on Seawolf, Trident, and Los Angeles Class nuclear submarines.
Paul Greco Skills
Paul Greco Education Details
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University Of Miami Herbert Business SchoolBusiness Administration And Management -
University Of ConnecticutMechanical Engineering -
University Of Massachusetts DartmouthMechanical Engineering
Frequently Asked Questions about Paul Greco
What company does Paul Greco work for?
Paul Greco works for Meta
What is Paul Greco's role at the current company?
Paul Greco's current role is VP Wearables Hardware Engineering.
What is Paul Greco's email address?
Paul Greco's email address is pg****@****eap.com
What is Paul Greco's direct phone number?
Paul Greco's direct phone number is +195488*****
What schools did Paul Greco attend?
Paul Greco attended University Of Miami Herbert Business School, University Of Connecticut, University Of Massachusetts Dartmouth.
What skills is Paul Greco known for?
Paul Greco has skills like Product Development, Six Sigma, Manufacturing, Mechanical Engineering, Leadership, Process Engineering, Tolerance Analysis, Project Management, Consumer Electronics, Process Improvement, Finite Element Analysis, Sheet Metal.
Who are Paul Greco's colleagues?
Paul Greco's colleagues are Nishi Jain, Or Hart, Uday K, Racquel Peralta, Shweta (I Am Hiring), João Gabriel Amorim, Soumya B.
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