• Solid background in the field of Semiconductor Assembly and Equipment Engineering.• Good knowledge in technical and engineering skills coupled with hand-on approach in front-end line process and technology.• Computer proficient in MS Office Software.• Strong orientation to teamwork environment and project management. • Knowledgeable Lean Manufacturing Single Minute-Exchange Die and Total Productive Maintenance.• Sustained and preventive maintenance of wire bonder machines such as KnS 8028/Plus/Ultra/Iconn so that breakdown is minimum and thus improve overall productivity.• Performed analysis for equipment trouble and take corrective measures to prevent recurrences and also study conversion time reduction for maximum productivity.• Able to work independently / Fast learner.
Listed skills include Management, Microsoft Word, Microsoft Excel, Research, and 12 others.