Finding, funding and shepherding innovators, innovations and infrastructure driving commercial impact in the Lab to Fab and Mission to Market paradigm.

Where you start a design has a big impact on the level of performance achieved and how long it takes to get there. I help Specialty Foundries, their Customers and Partners go Further Faster by providing a Better Technology Starting Point and Help Along the Way.

Startup Advisor, Candidate Screening, Semiconductor Innovation Advisor

Business Development and Solutions Architect for Aerospace and Government GTM team focused on DoD research and all things AI.

Advise the dean of the college of engineering on industry directions related to the wireless and semiconductor technology industry.Work with both the undergraduate and graduate engineering programs to align the curriculum for the jobs of the future.Mentor underprivileged and at risk students and sponsor and participate in graduate research programs.

RF Power Amplifier linear efficiency is difficult to achieve at mmWave frequencies.With Billions of 5G/mmWave PAs estimated to ship long term,Improving Linear Power Efficient Technologies is CriticalJoin Me in Connecting the World without Destroying the Planet!

Development and demonstration of next generation energy efficient RF and mmWave power device technologies via exploration, implementation and optimization of mmWave and 5G circuits to connect the world without destroying the planet.• Build and manage highly effective IC design teams to connect mmWave product requirements to the underlying technologies to drive the development of next generation technologies.• Deliver technology capability, readiness and yield via implementation of a ‘By Design’ methodology in GlobalFoundries current and next generation RF and mmWave focused technologies including SiGe, RFSOI and FDSOI.Focus• High Performance and energy efficient connectivity: 802.11ac/x, 5G mmWave and auto radar modules, tiles and transceivers with integrated and standalone RF power front ends.

Delivering a new kind of foundry experience via exploration, implementation and optimization of wireless circuit architectures and innovative technologies to improve customer and partner time to product.• Build and manage highly effective IC design teams to improve time to product for wireless connected systems and semiconductors• Deliver design innovation, differentiated design IP, technology capability, readiness and yield via implementation of a ‘By Design’ methodology in GlobalFoundries standard and differentiated semiconductor technologiesTeams and deliverables:• High Performance connectivity: 802.11ac, 4G and 5G mmWave, auto radar (modules, tiles, transceivers with integrated and standalone RF power front ends)• Wide, local and personal area low power connectivity: Dual Mode LTE CatM1/NB-IOT, 802.11bgn and 802.15.4., BT 4/5 (modules, basebands, transceivers with integrated RF Power front ends)• Full range (low power vs high performance) sensor interfaces: imager, 4G/5G, IOT data convertors and interfaces (wan/lan/pan)• Highly optimized SOC precision analog design IP including signal generation (DVCO, ADPLL ...), power management (charge pumps, LDO ...) and data interchange interfaces (SERDES ...)

Create and lead a world class team of semiconductor product and design engineers to deliver the core market and product specs for differentiated semiconductor products covering leading edge, mainstream and market specific semiconductor solutions.Delivered: Mobile, Industrial, Consumer, Automotive, Compute and Connected segments with product focused segment plans and investment business cases including everything from analytics and requirements to customer acquisition strategies.

• Identify and drive design innovation opportunities, requirements and deliver solutions with R&D.• Implemented innovative reference design strategies including RF and mmWave design methodology guide across EDA (Cadence, Ansoft, Xpedion) and foundry partners (TSMC, Jazz Semi, IBM).• Manage internal deliverables and overall business success through customer focused segment strategies, differentiated wireless design and verification products, regional business development activities and outbound marketing events and associated eco-system collaborative activities.

Plan, design, implement and document a set of wireless reference designs and associated Best in Class design and implementation methodologies to transform the way Cadence communicates with customers.• Authored Wireless Vertical Segment Application Strategy and Segment Requirements.• Created top down Wireless Vertical Segment design requirements for digital, analog and RF.• Responsible for the Vertical Kit Plan (MRD), managing engineering deliverables across multiple teams, validating delivered solutions and driving business success.• Developed strategies for Sales and Technical Field Operations to incorporate a wireless focus into customer facing activities including workshops direct customer interaction.• Provided a lead technical role in Cadence Customers Customer Relationship supply chain program for wireless.Delivered:• Wireless SOC Low Power Implementation Design Methodology and Implementation Guide (65nm 802.11bgn digital baseband)• Wireless SOC Functional Verification Design Methodology Guide (65nm 802.11bgn digital baseband)• Wireless RF Design Methodology Guide (180nm/65nm 802.11bgn radio/transceiver)• Systems in Package Co-Design Methodology Guide (180nm transceiver, 65nm baseband, FE components)

Early stage startup designing and leveraging innovative RF transceiver and front end module concepts to bring next generation LTE to a broader market.

• Early outside hire after Jazz spun out of Conexant in 2002.• Developed Customer Product Requirements Roadmap for silicon mm-wave and RF technologies.• Directed IP design effort for RF PA power cells and other associated components.• Created industry's first foundry reference design concept and product by designing and delivering complete WiFi based RF transceiver and associated design IP blocks and methodologies with internal and EDA/IP partners.• Conducted competitive Foundry analysis for SiGe, advanced RF CMOS, RF MEMS, silicon Nanophotonics and High-Voltage CMOS. • Co-managed device modeling team and created/managed world class RF pre/post sales applications team.• Drove internal efforts in product qualification, design kit and flow enablement, and technology development.• Led strategic tier 1 customer engagements for leading edge solutions development and deployment.

• Led product engineering on all Hesson Labs IC products (Network Processor, Switch Fabric, integrated 1-10 GB Ethernet, Fibre Channel, SONET OC12-OC192 serial interfaces).• Planned, developed, implemented and managed all post circuit design activities from netlist to engineering qualification/sampling including silicon engineering and qualification.• Developed high speed digital test and measurement environment for multi gigabit physical layer transceivers and performed all test, measurement and qualification activities including tape-out, silicon debug and reliability analysis.• EDA/CAD and Foundry Technology manager.• Developed hierarchical technology migration infrastructure and design rule correct automatic power and ground connectivity tool.

• Built the Austin Technology Center focused on System to Silicon physical and electrical EDA for Next Generation Technology and Product Development.• Built and managed Central US territory from the ground up including sales, critical support, design/development engineering teams and 3rd party relationships.• Managed development and implementation of strategic next generation products including Virtual Wafer Fab TCAD, Utmost Spice Modelling and Test hardware/software, and RF/Wireless Harmonic Balance simulation engine.• Senior technical specialist for circuit simulation, implementation (EDA), multidimensional physical simulation/modeling.

TI Defense Systems and Electronic Products Group (DSEG): mmWave Design Engineering Masters Fellowship• Term 1 DSEG: Characterization and design of Power Amps and RF switches for phase array radar.• Term 2 DSEG: RF PiN diode switch element technology bring up, production test development and characterization.• Term 3 Central Research Lab & funded Masters Thesis: Investigation of Defect limited storage time effects in vertical PiN diodes for microwave applications.

• Ships Intermediate Maintenance Facility, Mayport Florida - Troubleshooting and depot level repair of advanced electronic systems. - Managed high reliability repair lab and only ET certified to repair to original MILSPEC. - Sailor of the month, quarter and year 1993.• USS Mount Baker, AE4, various locations, special operations - Certified nuclear weapons security guard, radio/radar operation & maintenance/repair.• Nuclear powered submarine USS Sam Rayburn, SSBN 635 - Operate, maintain and repair high availability radar, electronic countermeasures and inertial navigation and supporting computer and location/positioning systems to enable positional accuracy for missile launch target of tens of feet over a minimum of 5000 miles.