Guidance and focus for a team of DevOps genii

Have you tried turning it off and on again?

Manual QA for frontend and backend (UI and Analytics). Selenium, pytest and Cypress automation for end to end testing of the app.

Geometry and Algebra2 - using technology to make math fun, interesting and relevant. Experience with BLEND, integrating all sorts of fun tools into the classroom.

Functioned as internal expert for Production Yield system○ Data sanitizing, new product configuration○ Responsible for developing new usage models○ Facilitated training sessions for new usersProfessional ExperienceDeveloped Yield templates for various internal teams, using Spotfire and direct SQL access to Yield system ○ Templates replaced labor-intensive manually generated weekly reportsPorted a Map Merging system into Yield system, SpotFire template to control via Web APICreated python scripts for Oracle SQL access. Versatile, flexible, easily tuned to specific engineer needs○ Query to extract single X/Y location across all data for a given product to highlight RDL trace defects○ Queries to extract all levels of data - Wafer level binning, Die level info, Parametric results, Stack Map results for bin or parametric for large wafer counts○ Reduced extract time for large datasets from hours/days to minutesExplored methods of combining test results into useful “fail signatures”, to allow better grouping ofcommon fail-modes and to highlight “abnormal” fail-modesImplemented wafer excursion notification and reporting system○ Inputs included text wafermaps, internally defined limits applied to each incoming wafer, shipping and testing dates and a Spotfire template to feed all this back to the database○ End product allowed monitoring of material as it completes test, and a report format by WW available as material ships to customers○ Revamped this entire system into a python script to fully automate report generation, saving hours per report (weekly)

Worked with Test Engineers to release new products to production, supported qualification and characterization efforts○ Debug of early version of internal characterization tool, developed SQL○ Developed a Spotfire front-end for an internal database for characterization datasets○ Provide quick data access to test engineers - processing, loading, analyzing, cleaning datasetsCompleted test program releases, driven by Customer Returns and other test program improvements○ Collected correlation data, applied CPK/GRR techniques, prepared Product Change Notice forcustomers○ Crafted all data into a cohesive, clear storyTested/Analyzed incoming Customer ReturnsExecuted qualification stresses, bring up of HTOL patterns, readpoint analysis○ Designed HTOL boards○ Worked with vendors to quickly bring up new hardware, new patternsLarge-scale data analysis aimed at low level defectsDiscovered and developed a recovery plan for nA level RDL leakage defect○ Utilized the production data available to isolate specific wafers for retest○ Proved through ATE test that this defect also caused functional fails

Taught pre-engineering courses through Project Lead the WayDigital Electronics, Principles of EngineeringInstrumental to Hays High School receiving national certification through Project Lead the WayImproved year to year math state assessment (TAKS) passing rate from 31% to 79%Experience with MultiSim simulation software, Fishertech and VEX robotics kits

Performed engineering analysis to support development of high performance microprocessor transistor nodes (approx. 3 nodes per year).Experienced at interfacing between design and integration communities to solve complex product interactions.Managed assembly, test and analysis of experimental split lots. Provided guidance for fab regarding transistor performance, operational window and yield.Proved design failure theory, correlating large backend dataset to inline electrical signals. Results affected disposition on ~10k wafers in fab.Searched for commonality signals to explain yield or performance issues using inline tool and wafer electrical data.Managed scheduling and testing for product qualifications, including HTOL, ESD, Latch-up and Temperature Cycling.Collected “Circuit Sensitivity” data across functional areas, ensuring products performed as expected across operating range (voltage, temperature and speed).Breadth of knowledge spans 180nm, 130nm, 90nm, 65nm technologies and K7, K8 and Greyhound AMD designs.