Ownership of CPU packing materials quality issues for 10 supplier sites. Conducted on-site supplier quality systems assessments, identifying quality systems gaps, leading gap closure activities. Process control systems (PCS) working group chair responsible for updating specifications and methodologies, training multiple business groups, and tracking continuous improvement projects.

45 nm, 32, and 22 nm process transfer owner of multiple RTA and flash anneal process layers from development to high-volume manufacturing . Lead multiple continuous improvement projects in defect reduction, test wafer usage reduction, and equipment utilization improvement.