Paul Schofield Email & Phone Number

Canmore, AB, CA

Totowa, NJ, US

Based in Shanghai, I am responsible for business development through non-domestic M&A, Alliances and licensing; I also serve as the company export compliance officer.

Together with IBM counterpart, responsible for developing an effective future for Altis. Altis is a captive foundry owned jointly by Infineon and IBM. We engaged a number of potential buyers, of these a limited number were taken through to due diligence of which one was brought to final signature.

The bulk of this time part of a 3-person team responsible for evaluating and negotiating Joint Ventures (Development and Manufacturing). Reporting directly to the CEO and the Board of Directors, developed agreements with partners principally in the US & Taiwan. Work included strategic planning, financing & negotiation. Partcipated in; Valuation, Scenario.

Responsible for product and business Development of MOSAID’s memory circuit designs. My tasks included; contract negotiations, design and device debug, yield improvement, product qualification (and market introduction), royalty revenue forecasting and participating in corporate strategy policy-making. I worked at the customer’s production facilities in.

Successfully brought to qualification a (then state-of-the-art) 1.0u, double metal, silicide with straps, CMOS process which was subsequently transferred to TSMC. Responsible for the management and execution of all product aspects including: product/process debug and characterization; yield optimization; reliability (trials, interpretation and.

Defined and commissioned the labor, software and equipment requirements to establish a Product Engineering Department for a 1.2u triple Poly CMOS Technology. (Product was 1 Mb DRAM purchased from Toshiba). Managed the successful development of my department including: recruitment, development and management of 20 person staff; yield analysis at wafer and.

July 1985 – Jan 1986 Product Transfer Manager Responsible for successful transfer and initial product debug into new NMBS, Fab in Tateyama, Japan of Inmos' (also new) 256 Kb DRAM.Oct 1984 – July 1985 Senior Product Engineer – Colorado Springs, USAEmigrated to US, successfully brought a 4Kbx4 CMOS High speed SRAM to production. Accountable for; product.

Hired as an Assistant Engineer and assigned to work on LF bipolar power devices. When I left, I was responsible for TI’s worldwide SCR and Triac Product Engineering.

Mba

Bsc, Materials Science