Circuit and Layout Design for High Speed ESD structures, Chip level Power and Signal Integrating Planning, Wire bound and Flip chip Layouts. Providing Management support for layout team. Reviews and Resource allocation.

I Started working in this organization since Nov, 2007. I worked on Dphy, PLL, USB 2.0, USB 3.0 and UHSII. In these IP's, I worked on Transmitters, Receivers, PLL, CDR, LDO,Analog Equalizer and Bandgaps. I have good expertise in both CIrcuit Design and layout which helps me understand the challenges and to arrive at proper solutions.

I joined this organization during campus recruitment. I was put into Texas Instruments Offshore Design center where I worked in RF (layout) team on modules like LNA's, Mixers, PLL etc later I was recognized as team lead. Later I moved into power management where I worked on Layouts of high power modules like SMPS (6v), LDO's, Temparature sensors etc. I have also worked on chip levels, I have successfully executed multiple test-chips and full chips. I received 2 letters of commendations from Texas Instrument for my contribution towards Analog Layout.