Payam Haghparast, Phd Email & Phone Number

Ottawa, On, Ca

Ottawa, Ontario, Canada

Duties & Responsibilities* Thermal Analysis (Flotherm, Ansys Icepak)* Mechanical Simulation (Probing, Wire bonding, ...)* Board Level Reliability (BLR)* CFD and FEA simulation in ANSYS.* Advanced thermomechanical simulation and optimization of IC packages including WLCSP, QFN, BGA, CBGA, eWLB, FCCSP, .... .* Stress and strain analysis, creep modeling, plastic deformation, vibration, and material analysis.* Heat Sink Design* Thermal interface material selection… Show more Duties & Responsibilities* Thermal Analysis (Flotherm, Ansys Icepak)* Mechanical Simulation (Probing, Wire bonding, ...)* Board Level Reliability (BLR)* CFD and FEA simulation in ANSYS.* Advanced thermomechanical simulation and optimization of IC packages including WLCSP, QFN, BGA, CBGA, eWLB, FCCSP, .... .* Stress and strain analysis, creep modeling, plastic deformation, vibration, and material analysis.* Heat Sink Design* Thermal interface material selection focusing on performance and reliability.* Board Level Reliability (Drop test, Bending test, Thermal cycling test, Vibration test, ...)* Familiar with packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)*Hotsopt Analysis of Finfets* Daisy chains and BGA DC resistance analysis*Optical Beam Induced Resistance Change (OBIRCH)* Spherical, Monotonic (Static), and Cyclic Dynamic Bending Tests (experimentally and numerically)* Circuit Level Thermal Study* Numerical Drop Test Simulation* Various HTOL Tests* Reflow thermal stress simulation* Wire bond fatigue* QSFP_DD Thermal simulation and its optimization* Polyimide, Nitride layer, Al Metal, Solder, UBM, RDL, ... optimization in WLCSP packages to control the Nitride Tension Stress* Dye and Pry testing* BGA Microstructure failure analysis* Polyimide Delamination Sim and analysis* substrate warpage optimizations in terms of copper density* Substrate Deflection Simulation in Electrical Socket Testing* PCB Thermal Dissipation Analysis and Optimization (PCB Thermal Management Techniques)* GaAs, Silicon, GaN, ... die strength study* Preparing POD and LP and their calculations* Reflow cool down rate effect study on failures in several packages.* Ansys HFSS, Ansys Mechanical, and Ansys Icepak integration to have more accurate simulations.* Effect of epoxy delamination on heat dissipation through the board.* Leica microscope measurements (ball height using profile function, diameter, ...)* Package detail 3D models (step files) Show less

Institut Interdisciplinaire D'Innovation Technologique, Sherbrooke, Qc, Canada

Duties & Responsibilities * CFD and FEA simulation in ANSYS. * Advanced thermomechanical simulation and optimization of microelectronic packages.* Fluid flow simulation in microelectronic packages.* Solder joint reliability simulation and lifetime prediction formula.* Wire bonding (ball and wedge bonding simulation for different packages)* Solar cell design (CPV) (Thermomechanical simulation)* Stress and strain analysis, creep modeling, plastic deformation… Show more Duties & Responsibilities * CFD and FEA simulation in ANSYS. * Advanced thermomechanical simulation and optimization of microelectronic packages.* Fluid flow simulation in microelectronic packages.* Solder joint reliability simulation and lifetime prediction formula.* Wire bonding (ball and wedge bonding simulation for different packages)* Solar cell design (CPV) (Thermomechanical simulation)* Stress and strain analysis, creep modeling, plastic deformation, vibration, and material analysis.* Programming in Python with the Object-Oriented Programming approach to estimate BGA lifecycle.* Crack simulation, BGA reliability, WLCSP, QFN design, Thermal Analysis * Material analysis. Show less

Sherbrooke, Quebec, Canada

Activities and subjects: * CFD simulation* Design of components for industrial cycles.* Energy efficiency.* Simulation of supersonic flows, and two-phase streams.* Programming (C++, EES, Matlab).* Experimental test bench.* StarCCM++, Openfoam.

Tehran Province, Iran

Monenco Iran Consulting Engineers Co. Member of MAPNA Group, Active in 'Oil and Gas', 'Power Generation', 'Systems and Energy Studies'. (https://monencogroup.com) (www.mapnagroup.com)Mapna Group provides comprehensive solutions for the development of thermal power plants, renewable energy power plants, combined water and power plants, development of onshore and offshore oil and gas fields and execution of rail transportation projects through application of cost and energy efficient and… Show more Monenco Iran Consulting Engineers Co. Member of MAPNA Group, Active in 'Oil and Gas', 'Power Generation', 'Systems and Energy Studies'. (https://monencogroup.com) (www.mapnagroup.com)Mapna Group provides comprehensive solutions for the development of thermal power plants, renewable energy power plants, combined water and power plants, development of onshore and offshore oil and gas fields and execution of rail transportation projects through application of cost and energy efficient and environment-friendly technologies. Since the inception in 1993, Mapna Group has been involved in more than 100 projects valuing over €30 billion. Show less

Iran

Phd, Mechanical Engineering

Master'S Degree, Mechanical Engineering (Heat Transfer, Fluid Dynamics)

Thesis: Optimization of heat transfer enhancement from a flat plate using genetic algorithm and artificial neural network technique..

Bachelor'S Degree, Mechanical Engineering (Solid Mechanics)