Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently the University Chancellor’s Professor at the University of California, Irvine (UCI).Payam is a fellow of the National Academy of Inventors and a fellow of IEEE. He is the recipient of the 2023 IEEE Microwave Theory and Technology Society (MTT-S) Distinguished Educator Award, the 2021 IEEE Solid-State Circuits Society (SSCS) Innovative Education Award, and Best Invited Paper Award at the 2021 IEEE Custom Integrated Circuits Conference. He was selected as the inaugural Faculty Innovation Fellow by the UCI Beall Applied Innovation. Payam was the Distinguished Lecturer of both the IEEE SSCS and MTT-S Societies. He received the 2014 Distinguished Engineering Educator Award from Orange County Engineering Council, the 2009 Business Plan Competition First Place Prize Award, and the Best Concept Paper Award both from Paul Merage School of Business at UCI, the 2010 Faculty of the Year Award from UC-Irvine's Engineering Student Council (ECS), the 2009 School of Engineering Best Faculty Research Award, the 2007 IEEE Circuits and Systems Society Guillemin-Cauer Award, the 2005 IEEE Circuits and Systems Society Darlington Award, the 2005 NSF CAREER Award, the 2005 School of Engineering Teaching Excellence Award, and the Best Paper Award at the 2000 IEEE Int'l Conf. on Computer Design (ICCD). His research on novel low-power multi-purpose multi-antenna RF front-ends received the Low-Power Design Contest Award at the 2008 IEEE Int'l Symp. on Low-Power Electronics and Design (ISLPED).He and his research group published two books, three book chapters, and 190 journal and conference papers. He gave Keynote Speech to IEEE GlobalSIP 2013 Symposium on Millimeter Wave Imaging and Communications and served as an Invited Distinguished Speaker to the 2014 IEEE Midwest Symp. on Circuits and Systems. Payam is an Associate Editor of the IEEE Journal of Solid-State Circuits (JSSC), IEEE Open Journal of Solid-State Circuits Society (OJ-SSCS), and IEEE Solid-State Circuits Letters (SSC-L). He was a member Technical Program Committee of the IEEE European Solid-State Circuits Conference (ESSCIRC), the 2021 International Microwave Symposium (IMS 2021), a member of AdCom for the IEEE Solid-State Circuits Society, and a member of the International Technical Program Committee of the ISSCC (2014-2019).Specialties: Design of Novel Analog/RF/Millimeter-Wave/THz Integrated Circuits for Sensing, Imaging, and Communications