Joe Dickson Email & Phone Number

Suzhou, Jiang Su, Cn

Disruptive PCB Solutions for BGA's. Thermal and SI developments. #panelsubstrates

Suzhou, Jiang Su, Cn

Leading World Class Product Engineering Teams for Advanced Volume Global PCB Supplier;Application Engineering: Total Product Development Roadmap, GM Analysis, and Customer Satisfaction Development ProgramProduct Development Engineering: Marketing and Technical Communications, DFM Modeling Tools for Advanced PCB Manufacturing (Multiple IP tools)Material Development Engineering: 3DMD Modeling, Radial Flow, Advanced Material Qualification Collaborating with WUS Sr Leadership on:New Site Design and Equipment Engineering (11th career site build), 2 Million SqFtAdvanced Large Panel Registration System (IP Equipment and Material)Long Term Product Strategy & Product ChangeProduct Innovation Group Developer, multiple BU/Site TeamWus Patent Program

NextGIn is next generation manufacturing technology for the Interposer and Printed Circuit Board industryhttp://www.nextgin-tech.com/

Advanced Product EngineeringGross Margin Material EngineeringFacility EngineeringPlant OptimizationMaterial & Process OptimizationEnvironmental and Cost Engineering

San Jose, Ca, Us

Transitional and Operational Process Development, Strategic Planning

San Jose, Ca, Us

Managed global supply base team for all PCB's. Supplier qualifications and assessments, along with quality escalations. $1B annual procurement budget. Advanced PCB design recommendations, along with cost/quality material stackup program. Surface finish and material qualifications.

Galway, Ie

Tyco International/Sigma Circuits, 1997 to 2002. Sr Technical Lead for Tyco acquisition of Sigma. Managed pre-production, quality and product/process engineering teams totaling 135 and budget of $10M. Orchestrated ISO 9002, TL9000 and Military Certified compliance programs at 11 separate manufacturing sites. Key interface with worldwide OEM partner. Tyco acquisition technical lead for 5 manufacturing facilities located globally.

Chandler, Az, Us

Managed all Process, Environmental, Product Engineering staffs. Greenfield installations to $50+ Million PCB and Back Panel Facilites. Including compliance to ISO 9002.

Lancaster, Pa, Us

Assisted in acquisition of Chemline by Armstrong. Managed the PCB PTH Chemistry and Photoimageable Solder Masks Globally. Trained distributors on application and installation processes. Set Roadmap for new product introduction. Managed COGS.

Established new territory in Northern Ca. Engineered and installed new PCB PTH process chemistries. Worked with R & D on new packaging and preformance additoins. Optimized process line for COGS requiresments. Negotiated warehouse contract for ODM chemistry (west coast manufacturing)

Eng Manager for PCB and Back Panel facilities. Largest Military BP supplier in the world. Specializing in extra large chassis manufacturing. Engineering lead on NTI facility startup. Most automated facility in the US at the time of opening. Environmental awards for water recycling system and electrolytic plating water treatment installation.

Houston, Texas, Us

Intern at HP PCB manufacturing facility. Supported the Process Engineering group. When the PCB site closed, I moved on to managed the Process Engineering groups of multiple HP suppliers.