Joe Dickson Email and Phone Number
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Previous Employer Summary;Sr Director of Technology for Tyco Electronics, Global Technical Leader Cisco SystemsManaged new PCB Manufacturing plant expansions globally (11 sites, 8 PCB sites,2 BPA, & 1 BP Pin Mfg) from concept through volume manufacturing. Waste treatment, Operations, Air Management.SME on PCB Product Engineering, signal routing, 3d mass displacement, physical SI influences, Gross Margin Material engineering.Technical Global Supply Management Expert - With over 15 years of Tech. Sr. Mgmt Experience either Managing ODM/JDM Suppliers or actually supporting the highest technical OEM customers like Cisco/IBM /HP.Extensive Military Supplier Managment Experience. Development/ Management of Supplier rating/ Techical rating and Supplier Roadmaps with DFM alignment. Product Development Leadership from ODM development through JDM advanced technology R&D programs. Cost & VE programs.Specialties: Lean/Six Sigma MBB, Problem Solving/Failure Analysis Trainer, Focused on Linking P&L to Critical to Quality, Customer, and Cost impacts. Previously worked on many industry councils including General Requirements for Implementation of SPC for the IPC. Two Cisco patents pending for manufacturng technology methodologies. Previously managed at Cisco the supporting technical groups for Backpanel Assembly, PCBA & DF, Printed Circuits, and Optical Connetors.
Wus Printed Circuit (Kunshan) Co., Ltd
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Svp Chip To Chip Reliability And InnovationWus Printed Circuit (Kunshan) Co., Ltd Dec 2019 - PresentSuzhou, Jiang Su, CnDisruptive PCB Solutions for BGA's. Thermal and SI developments. #panelsubstrates
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Sr Vp Product Operations & InnovationsWus Printed Circuit (Kunshan) Co., Ltd Jan 2014 - Dec 2019Suzhou, Jiang Su, CnLeading World Class Product Engineering Teams for Advanced Volume Global PCB Supplier;Application Engineering: Total Product Development Roadmap, GM Analysis, and Customer Satisfaction Development ProgramProduct Development Engineering: Marketing and Technical Communications, DFM Modeling Tools for Advanced PCB Manufacturing (Multiple IP tools)Material Development Engineering: 3DMD Modeling, Radial Flow, Advanced Material Qualification Collaborating with WUS Sr Leadership on:New Site Design and Equipment Engineering (11th career site build), 2 Million SqFtAdvanced Large Panel Registration System (IP Equipment and Material)Long Term Product Strategy & Product ChangeProduct Innovation Group Developer, multiple BU/Site TeamWus Patent Program
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Co-FounderNextgin Technology Bv Oct 2013 - Jan 2014NextGIn is next generation manufacturing technology for the Interposer and Printed Circuit Board industryhttp://www.nextgin-tech.com/
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Pcb Product & Manufacturing EngineeringConsultant For Asia Manufacturing Jan 2010 - Dec 2013Advanced Product EngineeringGross Margin Material EngineeringFacility EngineeringPlant OptimizationMaterial & Process OptimizationEnvironmental and Cost Engineering
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Six Sigma Master Black Belt CoeCisco Systems Mar 2002 - Dec 2013San Jose, Ca, UsTransitional and Operational Process Development, Strategic Planning -
Pcb Technical Global Supplier ManagerCisco Systems Mar 2002 - May 2006San Jose, Ca, UsManaged global supply base team for all PCB's. Supplier qualifications and assessments, along with quality escalations. $1B annual procurement budget. Advanced PCB design recommendations, along with cost/quality material stackup program. Surface finish and material qualifications.
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Sr Director Engineering/TechnologyTyco Electronics Mar 1997 - Jan 2002Galway, IeTyco International/Sigma Circuits, 1997 to 2002. Sr Technical Lead for Tyco acquisition of Sigma. Managed pre-production, quality and product/process engineering teams totaling 135 and budget of $10M. Orchestrated ISO 9002, TL9000 and Military Certified compliance programs at 11 separate manufacturing sites. Key interface with worldwide OEM partner. Tyco acquisition technical lead for 5 manufacturing facilities located globally. -
Director Of EngineeringSouth Bay Circuits 1992 - 1997Chandler, Az, UsManaged all Process, Environmental, Product Engineering staffs. Greenfield installations to $50+ Million PCB and Back Panel Facilites. Including compliance to ISO 9002. -
Product Manager, Pcb ChemistryArmstrong World Industries 1989 - 1992Lancaster, Pa, UsAssisted in acquisition of Chemline by Armstrong. Managed the PCB PTH Chemistry and Photoimageable Solder Masks Globally. Trained distributors on application and installation processes. Set Roadmap for new product introduction. Managed COGS. -
Tech Sales RepEnthone Chemistries 1987 - 1989Established new territory in Northern Ca. Engineered and installed new PCB PTH process chemistries. Worked with R & D on new packaging and preformance additoins. Optimized process line for COGS requiresments. Negotiated warehouse contract for ODM chemistry (west coast manufacturing)
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Process Engineering MangerSymtron/Nti 1982 - 1987Eng Manager for PCB and Back Panel facilities. Largest Military BP supplier in the world. Specializing in extra large chassis manufacturing. Engineering lead on NTI facility startup. Most automated facility in the US at the time of opening. Environmental awards for water recycling system and electrolytic plating water treatment installation.
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Eng. Tech, Process EngineerHp 1977 - 1982Houston, Texas, UsIntern at HP PCB manufacturing facility. Supported the Process Engineering group. When the PCB site closed, I moved on to managed the Process Engineering groups of multiple HP suppliers.
Joe Dickson Skills
Joe Dickson Education Details
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Mba Tm Technology ManagementTechnology Management
Frequently Asked Questions about Joe Dickson
What company does Joe Dickson work for?
Joe Dickson works for Wus Printed Circuit (Kunshan) Co., Ltd
What is Joe Dickson's role at the current company?
Joe Dickson's current role is SVP Chip to Chip Reliability and Innovation at WUS PCB Intl.
What is Joe Dickson's email address?
Joe Dickson's email address is jo****@****scn.com
What is Joe Dickson's direct phone number?
Joe Dickson's direct phone number is +192532*****
What schools did Joe Dickson attend?
Joe Dickson attended Mba Tm Technology Management.
What are some of Joe Dickson's interests?
Joe Dickson has interest in Kids, Cooking, Collecting Antiques, Medicine, Exercise, Electronics, Home Improvement, Reading, Crafts, Fitness.
What skills is Joe Dickson known for?
Joe Dickson has skills like Six Sigma, Manufacturing, Process Engineering, Product Development, Cross Functional Team Leadership, Engineering, Spc, Manufacturing Engineering, Process Improvement, Design For Manufacturing, Product Management, Operations Management.
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