Develop new product/packages from product design phase till qualification and LVM.Facilitate product design optimization and process methodology development for best quality/yield/cost effectiveness.Supervise and provide training & guidance to Engineers (9 eng'r staff) to achieve maximum team's performance effectiveness.

· Develop and process chaz for die preparation process (Poligrind/DBG/Hybrid dicing etc.), to meet new product’s process challenge and manufacturing. · Continually improve new DP process’s capability and stability, and enhance mature BG/dicing process’s productivity and TCO.

·Coordinate and facilitate SD / MicroSD cards(SIP Package) product qualification activity through product lifetime from design, qualification to ramp-up;·Interact between local MFG/Engineering team and Corp Package and product manager on new product and package qualification/transition with new scaling NAND silicon.·Co-work with core-functional team (Product design, Process and Test Engineering, Quality and Manufacturing etc) to fix assembly process challenge, and enhance new product’s assembly and FT’s yield and quality;·Define assembly and test process flow and BOM material, and maintain product database system in assembly/test port.

·Implement and support wire bonding process for new devices;·Qualify new and novel bonding material, tooling and technologies;·Troubleshoot process interaction issue and optimization to insure its yield stable and effective

·As outside customer ENG to qualify new assembly devices and customers in collaboration with designer, PE and MFG, co-work to solve all new products’ technical issue before VM.·As internal PKG Eng to evaluate new assembly material, tooling and package design for CSP package development.