Held bottom line accountability for creating and maintaining hardware engineering department design, review, and documentation processes, achieving ISO 9001:2015 Quality Management System certification. Spearheaded, coached and mentored hardware department teams, including Engineering Design Team (mechanical, electrical, and firmware engineers), hardware production test and assembly, and hardware production machine shop while supporting the purchase and optimization of a machine shop. Streamlined the engineering hardware production process by identifying and managing key suppliers. Conducted and presented ROI analysis and hardware design cycle time reduction analysis to business. Controlled engineering data and ShopTech E2 ERP system for engineering production parts inventory control and shop build scheduling by implementing SolidWorks PDM system.Key Contributions:Proficiently reduced overall engineering design to production release cycle from 12+ months to four months.Successfully improved hardware engineering design, prototyping, and production release processes.Effectively delivered high level leadership in developing ISO certified engineering process from scratch.Minimized development cycle time from 18 months to under six months.Awarded Patent # 10438503 "System and method for simulated non-lethal weapon training"

Provided leadership support in developing and designing state of the art hardware electronics packaging for insertion into the SM-2 guidance section while leading and controlling Mechanical Team. Orchestrated bid and proposal support for various mechanical proposals. Delivered specialty mechanical design program peer reviews and independent review investigations.Key Contributions: Distinctively attained Raytheon Six Sigma “Presidents Award” for SM-2 yield improvement in 2009 by resolving thermal issues, and RF vibration induced failures related to crystals and filters.Successfully maintained cost and schedule on mechanical guidance section upgrade (2.5-year effort).Efficiently delivered expert technical advice regarding electro mechanical production thermal and vibration failures.

•Managed the Mechanical Advanced Packaging Design and Analysis group. This group consisted of 28 mechanical engineers. The group provided mechanical design, analysis, and project engineering support to the Advanced Communications division at Rockwell Collins (RC).•Supervised and approved all mechanical bid and proposal activities for the Advanced Communication programs (~$35M/yr. M.E. content).•Interfaced with Directors and Department managers to coordinate the mechanical staff planning and deployment in a manner that met the corporate and customers goals.•Responsible for performance reviews, mentoring, staffing decisions, and proper skill set mix.

•Responsible for identifying and qualifying new mechanical related technologies for RC Government Systems. Technology areas included advanced thermal cooling solutions, electronic component durability, advanced PWB technologies, and electronic component mechanical packaging. •Collaborated with operations to ensure the supply base and production facilities were prepared for all new technology insertions.•Project Engineer & cost account manager for RC Government Systems thermal and advanced packaging IR&D projects. Maintained mechanical technology roadmaps which included thermal, PWB, and electronic component durability issues.•Maintained mechanical technology roadmaps for advanced thermal solutions, PWB technologies, and electronic component durability.

•Designed electronic equipment for Air Force, Navy, and Army DOD customers. •Responsible for thermal, vibration, and structural analysis of electronic systems.•Developed analysis and test verification techniques for fluidic cooling of electronic components in harsh environments. Constructed and managed a thermal testing lab that supported the verification of air and liquid cooling electronic systems.

LaSalle Nuclear Plant, IL - Provided system startup testing, plant modification engineering, and plant operation support.