QUALIFICATION SUMMARYOver 20 years of electrical engineering experience in quality and failure analysis, including semiconductor and repair. ACCOMPLISHMENTS• Increased repair quality average customer survey ratings from < 7 to > 8. • Reduced labor from days to minutes programming a MS Excel VBA macro to consolidate data from customer surveys and repair database reports.• Eliminated mainboard inspection errors by adding MS Excel formulas to scanned label spreadsheet automatically identifying errors by coloring cells. • Appraised hot carrier reliability for 0.5 micron process in an integrated circuit wafer facility through programming analyzer to automatically measure and set stress conditions. • Automated parametric test by programming four independent probes and a switching matrix. • Identified surface state root cause in HgCdTe focal plane arrays by writing a program taking 3D data of capacitance versus voltage and frequency. • Automatically identified difference between shorted HgCdTe capacitors and high contact resistance using two frequency impendence measurements in the test program. • Initiated corrective action for Windows updates by verifying symptoms of Windows trying to update and matching with customer complaints in the surveys.• Attained additional warranty coverage for customers and OEM corrective action by photographing and reporting to OEM a hinge problem on a particular model. • Triggered OEM to publish a fix for preinstalled software by identifying a related internet news article and reporting it to OEM. • Resolved parts issues by identifying the parts delivered from the warehouse and working with the planners to verify or fix the supply. • Moved and expanded two mainboard repair lines from two to five. • Eliminated final test failures with measurement technique at ECO inspection to verify correct value of replaced resistor during ECO implementation.