Peter Dirks, Msc, Pmp Email & Phone Number

Arnhem-Nijmegen Metropolitan Area, GE, NL

Leuven, Belgium

Nijmegen Area, Netherlands

Process development of pick and place of lenses. Optics and IC package engineering. Project lead motion sensor development.

Nijmegen Area, Netherlands

IC Package and Assembly Engineering, Supplier Management. BGA MCM (RF, digital and analog) development, 40GHz FCBGA development, Dual row QFN development.

Project management thin die assembly project. RF Power IC Package development and industrialisation project. Die bonding and dicing optimalisation.

Responsible for:Innovation, development, qualification and scheduling of packages for Power Management IC´sDesign of packages for Power Management applications, electrical optimizationOutsourcing and management of package development projects to internal and external Package Assembly factory in Philippines, Taiwan, Shenzhen and to Philips Applied.

Responsible for IC process roadmap and IC process development. Responsible for Package and Assembly roadmap and development.Project Manager C50PMU Process development within Business Line.

Groupleader Test and Product Engineering / Industrial and Quality ManagerManagement Team Member Business Line Power Control IC’sResponsible for staffing of engineering projects, people management, department budget, product cost (yields, testtime), product releases, supply management, quality, product transfers.

Managed ASIC development projects with IC Design done by Philips or by customer. Responsible for cost, schedule and specification. One of the larger projects contained AD convertors and Digital Signal Processing for filtering bits from a tape streamer.

A MIPS RISC processor core was ported to a Philips Semiconductors process. Verilog simulations ran in a virtual testbench to verify all instructions. Simulations with backannotated timing were done.

Design hardware overall architecture image processing digital copier. User functionality, technical possibilities and cost are taken into account. The whole image processing was described at a high level in C++. Detailed design and implementation of compression and memory. Compression and Memory Controller described and simulated in VHDL, simulated and.

Specification and design of analog and digital ASIC’s. A pressure transducer IC and a switched capacitor IC were developed.Writing ASIC testprograms in C like language.

Mssc (Ir.)

Education record

Education record

Project Management Professional