Director of Engineering responsible for ASIC Development, Microelectronic Packaging, FW Engineering, and Wireless Engineering in a technology development organization.

Senior Manager of IC Platform team; responsible for definition, development, and validation of platform IC's focusing on ultra-low power analog, DSP, and power management functions.

P&L responsibility for TI’s magnetic storage preamplifier product line representing approximately $400M in annual revenue; responsible for product development organization while working with colleagues in a matrix organization (Finance, Operations, Quality, Sales, HR, Sustaining, and Executive Management) to manage product line and overall storage business.

Responsible for seven FAE’s located in multiple locations providing customer support, IC performance evaluation, and product support collateral for TI's magnetic storage preamplifier IC product line.

Provided customer IC design consultation and application support for analog foundry (Polar Fab) customers focused on power management and optical disk drive integrated circuits; consulted in all aspects of analog IC design, layout, physical verification, and failure analysis.

As a technical leader, developed industry leading SiGe IC's for optical communication systems. Progressed to Director role responsible for Minneapolis Design Center focused upon developing high data-rate SiGe and CMOS physical media front-end IC's for optical communication systems.

Progression of IC Design Engineer positions from Associate to Consultant over 5 plus years; broad responsibilities and experience relating to the definition, design, and verification of several generations of VTC Preamplifier products. Customer engagement included product definition, design-in support, and resolving quality/reliability issues.