Peter Neklyudov Email & Phone Number

Billerica, Ma

Malrborough, Ma

Led and co-led design of Development Kit Board (DKB) for the company latest mobile ARM – based System-on-Chip (SoC) - IAP140, IAP220 (for IoT applications), PXA62x, PXA3xx, PXA168, PXA2128, PXA1088, PXA1928.The DKB feature set targets Internet of Things, or Tablet Computer/Smartphone device market, enabling the SoC and a wide range of relevant peripheral devices. ✓ Wrote Product Requirement Document for the DKB and presented the document across various teams to get the most desired feature set. Proposed System Architecture for the DKB and mechanical form-factor. ✓ Participated in SoC ball out pattern definition for the easiest routing of high-speed memory interfaces (LPDDR3/4, DDR3/3L, MIPI DSI, CSI). ✓ Worked closely with Power Management IC team to define a power-up order and proper supply voltage set for the SoC. ✓ Worked directly with IC suppliers to select the most advanced set of IC peripheral devices supported by the SoC. ✓ Created DKB and plug-in board schematics entry (Concept HDL, Allegro Orcad Capture). ✓ Wrote layout guidelines, validated DKB Signal Integrity (SI) for high speed interfaces. ✓ Supervised external contractors for the board layout (Allegro PCB), manufacturing and assembly. ✓ Brought up DKB and plug-in boards, developed and supported board firmware (CPLD, FPGA, apps. processor). ✓ Debugged and validated new peripheral ICs and modules (like Memory, AMOLED display, MIPI/parallel LCD, MIPI/parallel CMOS/CCD camera, GPS, WiFi/BT, pressure, humidity, proximity, light, touch, accelerometer, compass sensors). ✓ Participated in new SoC silicon stepping bring-up effort (including multiple domestic and international travels). ✓ Trained DKB customers and provided on-going support, including addressing internal/external customer questions, reviewed customer design schematics/layout, re-worked boards to correct functional/electrical issues, wrote Engineering Change Order documents.

Hudson, Ma

✓ Design of DKBs for Xscale Applications Processor SoCs: PXA3xx, PXA250/270.✓ PXA270 - based smartphone design (electronics show concept)

Troy, Ny

✓ Modeling and characterization of Organic Thin Film Transistors

St. Petersburg, Russia

✓ Calculated multi-layer structure and grew (Al,Ga,In)Sb/InAs heterostructures for far-infrared (3-5 um) laser diodes by Molecular Beam Epitaxy (MBE) technology

St. Petersburg, Russia

✓ Analyzed thermodynamic aspects of MBE growth of (In,Ga)As/GaAs strained epi-layers

Doctor Of Philosophy (Ph.D.), Electrical And Electronic Engineering, 4.0

Activities and Societies: DivingPh.D. Thesis: "Modeling and Characterization of Pentacene Organic Thin Film Transistors". M.S. Thesis.

Bachelor’S Degree, Optoelectronics, 3.8

Activities and Societies: Mountaineering/rock climbing clubThesis: "Thermodynamic Analysis of (In,Ga,)As/GaAs interface formation.

Education record