Peter Yablonsky Email & Phone Number

Greene, Ny

Advanced and New Product Introduction

Lead I/T management and staff responsible for Desktop and Mobility Device support of commercial and IBM end user sets across North America. Perform management of direct reporting personnel and subcontractors. Responsible for fulfillment of all resource, HR, and legal obligations.• Drive and implement defect prevention methods, technology currency projects, software platform management, service level attainment for standard, custom, and executive services, executing rollouts of Windows 7 and 10, resulting in significantly reduced support costs.

Oversaw implementation of specialty Linux desktop platform across IBM USA for high-security users. Provided guidance to worldwide teams. Managed cross-organization activities. Drove end user training. Executive interface. Continued to manage Windows platform services to end user set.• Exceeded development, rollout and training schedules of project, while achieving lower-than-expected defect rates.

Integrated numerous large brand commercial accounts into IBM Services portfolio. Led and coordinated simultaneous transition projects while ramping up steady state operations.• Oversaw delivery schedules for transitions and projects, exceeding all service level commitments, ramping up support of 180k+ end users.

Developed and drove implementation of global resourcing for internal account.• Led organizational LEAN analysis and transformation to optimize delivery, realizing 20% reduction of headcount.

Acted as executive sponsorship to consolidate multiple I/T organizations. Drove significant operational and asset cost efficiencies. Responsible for team building and all aspects of resource management while directing key projects, service level attainments, costs of services, and customer relations.• Led key I/T disciplines, including application development / maintenance, networking, host systems, servers, help desk, and desktop, into 1 resultant $40M operation, reducing cost by $4M in each of 2 subsequent years.

Held various engineering management positions in the Electronics Packaging field inclusive of all key engineering disciplines – electrical, mechanical, chemical, and systems engineering. Assignments included process and tool technology development, manufacturing processes, business planning, and project management. Responsibility for cost and schedule attainments. Served as International intra-company liaison.