Peter Yan Email and Phone Number
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Information and Communication Technology (ICT) and Wireless technical/marketing professional, focusing on Quality of Experience and Transactive Energy applications leveraging Crypto-currencies. Working with SmartMesh/MeshBox team to leverage the uniquely qualified SMT and MESH tokens to realize an Off-Internet, Off-Chain, and Off-Grid infrastructure, which enable Micro-Grids, Mesh-based Device-to-Device Communications, Unbanked Commerce, Transactive IoT, and the emerging EnerNet (Energy Internet).Background:• Internet Core Router architecture• Quad-play QoS Traffic Management• IEEE 802.1Q Standards (Ethernet)• Data-Center Switch Fabric (Broadcom 56843)• Data-Center and EnterpriseArchitecture for scalability• Cloud Radio-Access-Network (CRAN), 5G Cellular, NFV• Multi-Core System-on-Chip (SoC) Architecture• Network-on-Chip (NoC), 2.5/3 Dimensional Die stack, and wireless chip-to-chip communication.• Application-Specific-Integrated-Circuits (ASICs)• Autonomic Job/Message Scheduling• Realtime heterogeneous DSP/CPU, distributed scheduling• Real-time Latency-Rate Server Service-Level-Agreements (SLA)• Transactive Energy and Smart-Grid architecture
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Meshbox Chief Executive OfficerMeshbox Aug 2019 - PresentSingapore, Singapore, SgDriving MeshBox technology deployment worldwide as a HyperMesh Connectivity solution. -
Meshbox Chief Technology OfficerMeshbox Aug 2018 - Jul 2019Singapore, Singapore, SgResponsible for Technical Roadmap of MeshBox hardware, which supports SmartMesh blockchain and ecosystem partner protocol stacks. -
Meshbox Chief ScientistMeshbox Feb 2018 - Jul 2018Singapore, Singapore, SgLed technical solutions development for MeshBox Foundation. -
Smartmesh AdvisorSmartmesh Feb 2018 - PresentSingapore, Singapore, Sg -
Senior Engineer, SocSelf-Employed Aug 2017 - Feb 2018
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Senior Staff Engineer, America Wireless Access Labs, Baseband SocHuawei Technologies Aug 2010 - Aug 2017Shenzhen, Guangdong, Cn• Addressed Digital-Signal-Processing (DSP) and Central-Processing-Unit (CPU) SoCs’ inefficiencies in terms of wasted cycles controlling data-movement and synchronization. - Specified Autonomic Transport circuitry (which offload DSP/CPUs), including Task Scheduler, Queue Management, Buffer Management, and Edge-Controller (2-sided Direct-Memory-Access (DMA) with multi-mode isolation) - Resulted in Message-Queuing and DMA improvements being incorporated into Huawei’s baseband SoCs (HiSDRv61xx).• Addressed Real-time Service-Level-Agreement (SLA) guarantees for 4th and 5th Generation Cellular, Cloud RAN and NFV, rather than relying on simulation - Scheduling of Task-Graphs (Directed-Acyclic-Graphs) with dependencies to compute Firm-Real-Time and Soft-Real-Time schedulability on Heterogeneous Multicore Platforms - Developed slack-based and latency-rate server schedulers for Many-Core systems, with multiple Clusters/Tiles - Developed hierarchical scheduler based on space-time regions representing resource pool (processors and memory) utilization to optimize for power utilization.• Addressed SoC Interconnect scalability and high latency issues due to only 68% efficiency from Head-of-Line blocking. - Led performance evaluation (including simulation) of several commercial NoCs for Huawei HiSilicon. - Proposed Clos-based NoC architecture which increased efficiency to 92% and resulted in NoC being included into Huawei SoCs (HiSDRv61xx) -
Principal-Scientist, Enterprise Switching Business-UnitBroadcom Inc. Oct 2009 - Aug 2010Palo Alto, California, Us• Spec-owner for next-gen Ethernet Switch SoCs (BCM 56843; 640 Tb/s) which is a part of Broacom’s 80% market penetration for Data-Center and Enterprise networks.• Participated in IEEE 802.1Q Ethernet standards including Qbb Priority Flow Control, Qau QCN Quantized Congestion Notification, and Qaz Enhanced Transmission Selection.• Defined requirements and features for Ethernet Switch debug, packet memory-management, queuing, and scheduling in order to optimize for throughput, latency, and lossless/lossy requirements. -
Systems Architect Consultant, Network Research GroupHuawei Technologies Jan 2009 - Sep 2009Shenzhen, Guangdong, Cn• Led the Requirements and Architecture definition for next generation unified switch-fabric Application-Specific-Intergrated-Circuits (ASICs). Architecture addressed various network element requirements including Core, Edge, Aggregation, and Data-Center networks. Switch fabric is targeted for high-end, multi-chassis systems supporting 100+ Gb/s interfaces.• Developed Performance versus Cost quantitative metrics in order make architecture tradeoffdecisions. -
Systems Architect, Business Development And Strategy GroupFreescale Semiconductor Dec 2007 - Nov 2008Austin, Texas, Us• Developed Technology and Platform architectures for next-generation Multi-Core SoCs. Contributed to marketing efforts of SoC products for Access, Printing and Imaging, and Enterprise Routers with $1.2B in annual revenue. • Created and presented at Freescale Technology Forum: “Multi-Core Processor Interconnect Solutions” in 2007 and “Multi-Core Solutions and Applications” in 2008. • Specified requirements for Multi-Core SoCs targeting WCDMA and LTE eNodeB equipment. Determined mapping of baseband, L2, and Transport Protocols to QorIQ CPUs, hardware accelerators, datapath acceleration architecture, and memory sub-system.• Demonstrated how 3D-Integration of multi-die can increase margin by 11% and reduce manufacturing cost by 14% for the Multi-Core P4080 SoC.• Created SoC architecture addressing IPTV streaming media servers which includes networking, storage, and scheduling of Advertisement-Insertion. -
Systems Architect, Packet Systems GroupFreescale Semiconductor Nov 2006 - Dec 2007Austin, Texas, Us• Wrote Product requirements for next generation P4080 Multi-Core SoC including Network Quality-of-Service, Platform (interconnect, memories, aggregators), and Datapath Acceleration logic.• Proposed System (Switch / Router) level flow control architecture in order to support Class-based and Virtual-output-Queuing flow control for I/O. Schemes increased throughput by 18% and 36% respectively.• Proposed improved multi-level queuing arbitration algorithm which results in linear bandwidth allocation with setting of weight parameters through hardware-friendly WFQ algorithm.• Proposed Memory Transaction queuing architecture for DDR Controller based on Banks, Pages, tRAS parameters in order to improve DDR throughput.• Developed Network on Chip architectures for next generation Many-Core SoCs.• Specified architecture for 6-level hierarchical WFQ traffic scheduler supporting 5 million flows as required by a Tier-1 Wireless equipment manufacturer. -
Chief Technology OfficerErlang Technology Jun 2003 - Oct 2006Us• Developed marketing plan and technology roadmap for switch fabric and bridging ASSPs including product definition, strategic value proposition, and positioning.• Created and presented joint development project with LG Electronics (South Korea). Managed engineering team implementing a Switch Fabric chipset used in the Multi-Service-Router-40 deployed in Korean Telecom’s carrier networks.• Created and presented system architecture proposals to Tier-1 communications OEMs and TEMs to sell switch fabric products: Lucent, Alcatel, Nortel, Ericsson, Cisco, Huawei, ZTE, LGE, Samsung, NEC, Hitachi, Fujitsu, Alaxala, etc. • Created marketing strategy presentations for investors to raise $30M over a 7 year period.• Gave talks at various conferences and tradeshows including Linley Group, RapidIO Summit, Globecom, Bus and Board. Press tour for Xe Switch chipset resulted in Best Switch Fabric Award from Analog Zone in 2004. -
Vice President Of EngineeringErlang Technology Sep 1999 - Jun 2003Us• Generated technology portion of business development proposals which led to securing investment, partners, and design-wins with LG Electronics, NEC Electronics, Intel, Agere Systems, and Motorola (Cport).• Led Customer marketing targeting Tier-1 OEMs including Cisco, Nortel, Lucent, Alcatel, Ericsson, Huawei, ZTE, Beijing Capitel, and Samsung. • Wrote Statement of Work for Joint Development Contracts with LG Electronics and Electronics and Telecommunications Research Institute (ETRI) of South Korea. Contracts brought in over $6M for NRE design work.• Led Marketing Requirements Definition specification of Erlang’s ENET Se and Xe Terabit Switch Fabric and Traffic Management chipsets. -
Engineering ManagerMinmax Technologies Sep 1997 - Sep 1999Coordinated the detailed specification and implementation of the ATM Switch Module (ASM) ASIC. Led implementation team in ASM development. Created Data Sheet to be released to customers.
Peter Yan Skills
Peter Yan Education Details
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Washington University In St. LouisElectrical Engineering -
Washington University In St. LouisElectrical Engineering -
Washington University In St. LouisElectrical Engineering -
Washington University In St. LouisComputer Science
Frequently Asked Questions about Peter Yan
What company does Peter Yan work for?
Peter Yan works for Meshbox
What is Peter Yan's role at the current company?
Peter Yan's current role is Chief Executive Officer at MeshBox Foundation Pte. Ltd..
What is Peter Yan's email address?
Peter Yan's email address is ya****@****ail.com
What schools did Peter Yan attend?
Peter Yan attended Washington University In St. Louis, Washington University In St. Louis, Washington University In St. Louis, Washington University In St. Louis.
What skills is Peter Yan known for?
Peter Yan has skills like Lte, System On A Chip, Application Specific Integrated Circuits, Semiconductors, Wireless Technologies, System Architecture, Embedded Systems, Internet Protocol, Telecommunications, Algorithms, Asic, Debugging.
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