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Philip Coady Email & Phone Number

Vice President, Operator Sales at Blonder Tongue Labs
Location: Atlanta Metropolitan Area, United States 13 work roles 1 school
1 work email found @bellsouth.net LinkedIn matched
✓ Verified July 2026 4 data sources Profile completeness 86%

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Role
Vice President, Operator Sales at Blonder Tongue Labs
Location
Atlanta Metropolitan Area, United States

Who is Philip Coady? Overview

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Philip Coady is listed as Vice President, Operator Sales at Blonder Tongue Labs based in Atlanta Metropolitan Area, United States. AeroLeads shows a work email signal at bellsouth.net and a matched LinkedIn profile for Philip Coady.

Philip Coady previously worked as Vice President, Operator Sales at Blonder Tongue Labs, Inc. and Director, Operator Sales at Blonder Tongue Labs, Inc.. Philip Coady studied at Memorial University, Newfoundland And Labrador.

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About Philip Coady

May-2021 - Jan-2023Blonder Tongue Laboratories - VP, Operator SalesJan-2019 - May-2021Blonder Tongue Laboratories - Director, Operator SalesJan-2015 - Dec-2018ADB Global - Sales EngineerJan-2013 - Dec-2014ViXS Systems - Technical Sales Account ManagerSept 2011 - PresentFidelis Securities Trading - Managing PartnerJanuary 2007 to Sept 2011Entropic Communications - Technical Sales Account Manager September 2005 to January 2007Entropic Commuincations - Sr. Hardware Applications Engineer January 2004 to August 2005 AMCC - Field Applications Engineering Manager May 2001 to January 2004AMCC - Principal Field Applications Engineer January 2000 to May 2001AMCC - Sr. Applications Engineer May 1998 to January 2000 Lucent Microelectronics - Applications EngineerMay 1996 to May 1998 Amphenol Canada Corporation - Design Engineer July 1991 to May 1996Ford Motor Company - Product Design/Process Engineer February 1989 to July 1991Reliance Comm/Tec - Power Supply Design Engineer

Listed skills include Semiconductors, Ethernet, Rf, Embedded Systems, and 35 others.

13 roles · 38 years

Philip Coady work experience

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Director, Operator Sales

Old Bridge, Nj, Us

Responsible for CPE/Headend equipment sales penetration strategies/activities for North American Cable MSO's and Telco's across residential and commercial (MDU) deployments.

Jan 2019 - May 2021

Managing Partner

Fidelis Securities Trading Inc.
Sep 2011 - Jan 2019

Sales Engineer

Adb Global

Sales Engineer/HW-SW Support Engineer/SLM/PLMResponsible for North American CATV MSO (Time Warner Cox, Charter, Brighthouse, Comcast) pre/post sales system software/hardware sales and support for ADB’s end to end interactive Commercial Video Solution (vuTyme) system for commercial/hospitality/MDU applications. Pre-sales duties involved working with MSO’s and hoteliers to position the vuTyme solution to enhance richer in room guest viewing experiences while enabling additional MSO and hotelier revenue streams for linear, IP(CDN) and VOD content. Post sales duties involved Linux server/Set Top Box setup/debug utilizing customer located data center HW as well as ADB hosted AWS cloud servers. Acted as project manager for product field trial rollouts for new HW and SW versions working closely with MSO tech opps teams. Worked with MSO prod mkntg teams to define next gen features and requirements aligning ADB and MSO core product directions. Responsible for SOW creation for MSO custom integration work (HW and SW)

Jan 2015 - Dec 2018

Technical Account Manager

Vixs Systems Inc.

Responsible for North American Cable OEM/Operator sales penetration and technical support for MoCA and transcoding product lines. Coordinated/facilitated technical/sales discussions between ViXS Systems and OEM’s/Operators to enable MoCA/transcoding product positioning and sales into Cable modems, Set Top Boxes, Residential Gateways. OEM/Operator support included HW design guidance, SW API code integration, schematic/layout reviews as well as prototype bring up and debug along with system integration and debug at OEM/operator level.

Jan 2013 - Dec 2014

Technical Account Manager

San Diego, Ca, Us

Responsible for North American/EMEA technical sales support for Tier 1 OEM (and associated ODM) activities as well as OSP/MSO engagements to further promote MoCA technology propagation while enabling Entropic revenue streams. Coordinated/facilitated technical/sales discussions between Entropic, OEM’s and OSP’s/MSO’s to enable Entropic product positioning and sales into Set Top Boxes, Residential Gateways, Broadband Home Routers, Wi-Fi Extenders and associated home networking equipment.

Jan 2007 - Oct 2011

Sr. Hardware Applications Engineer

San Diego, Ca, Us

Responsible for worldwide hardware support for Entropic’s c.LINK chipset used to develop MoCA (Multi-media over Coax Alliance) compliant solutions such as Set Top Boxes, Media Gateways , Optical Networking Terminals . Supported customers during pre-sales and post sales efforts and involved guiding customers during architectural definition, design phase, schematic review and PCB layout, proto bring up, system debug and optimization. Responsible for writing data sheets as well as app notes associated with the hardware aspects of this solution. Supported customers with diplexer architecture and system integration strategies as well. Worked with service providers in initial equipment certification efforts to ensure interoperability between STB’s, MG’s and ONT’s. Involved with software elements of these systems as they related to the c.LINK chipset software driver.

2005 - 2007 ~2 yrs

Field Applications Engineering Mgr

Applied Micro Circuits Corporation

Responsible for a team of 6 FAE’s supporting AMCC silicon products. (Network Processor, Traffic Managers, ATM/SONET Framers and Mappers, Switch Fabrics, PHY/PMD and PowerPC devices. In addition to my own account responsibilities as listed as an FAE, I provided direction to the FAE team on account ownership and responsibility providing technical guidance for pre and post sales efforts. Liased FAE's with marketing teams to help define and penetrate targeted markets. Responsible for setting FAE goals and objectives, account loading as well as FAE training regimens. Coordinated FAE’s with AMCC Regional Sales Managers, external Manufacturers REP'S as well as channel distribution sales staff for tactical and strategic account support/penetration.

Jan 2000 - Aug 2005

Sr. Factory Applications Engineer

Applied Micro Circuits Corporation

Responsible for SONET 10Gbps (OC-192) and 40Gbps (OC-768) Physical Layer device system architecture and specification. Responsible for 10Mbps to 2.7 Gbps clock data recovery (CDR) device system architecture and specification. All product definition based upon customer requests/interfacing and market requirements. Generated customer application notes/reference designs utilizing said components. Supported customers and field application engineers/sales force on issues specific to CDR/10 Gbps/40 Gbps devices as well as general high speed, design procedures (e.g. board layout, de-coupling, high speed trace routing etc.)

2000 - 2001 ~1 yr

Member Technical Staff

Lucent Microelectronics

Responsible for Fast Ethernet (1, 4, 6, 8 and 12 channel) and Gigabit Ethernet (single channel) transceiver applications support. Designed reference designs and evaluation boards. Wrote device data sheets/eval card user manuals as well as device applications notes detailing correct system design methodologies. Performed device prove-out/debug and detailed device characterization on initial version "0" and beyond devices. Actively participated in product definition based upon customer requests and market requirements. Performed competitive analysis studies against other Fast Ethernet and Gigabit Serdes devices generating a white paper detailing the results. Trained FAE's on various aspects of evaluation card use and device operation. Supported design, marketing and FAE teams as required. Very familiar with IEEE 802 standards with respect to Ethernet twisted pair / FDDI signaling. Interfaced with customers to refine and implement their requirements.

1998 - 2000 ~2 yrs

New Product Development Engineer

Wallingford, Connecticut, Us

Responsible for the development and design of RJ-45 high speed data connectors used in 10/100 Fast Ethernet hardware. The new connectors integrate the magnetics found on Fast Ethernet hardware (NIC's, HUB's, etc.) into the RJ-45 connector.Responsible for the development and design including research, development, electrical and magnetics design, mechanical design, prototyping, documentation and manufacturing process setup. Connector prove out to ensure IEEE 802.3/802.3U and ANSI X3.263 TP-PMD compliance required the design and manufacture of several PCI based 10/100 NIC's and one 8 port 100 Mbps HUB. Responsible for the design/layout and manufacture of said NIC's and HUB's. Hub and NIC designs based upon Quality Semiconductor's QS 6611 and QS 6612 10/100 Fast Ethernet transceivers as well as DEC's 21143 MAC, INTEL's 82557 MAC and the MACRONIX 98741 repeater controller.

1996 - 1998 ~2 yrs

Product Design Engineer

Dearborn, Michigan, Us

Responsible for designs of Anti-Theft, Redundant Steering Wheel Control and Programmable speedometer/Odometer Modules as well as the Virtual Image Electronic Instrument Cluster. Act as liaison to customer plants. Also created forward model designs for non-FORD applications. All units based on 68HC11 and 68HC05 micro-controllers. Responsible for all aspects of designs, topology, PWB layout, EMC compatibility etc. Also responsible for creating/editing repair shop manuals. Responsible for the processes, which manufactured Electronic Instrument Clusters/Anti-Theft Modules. Duties included resolving line issues due to supplier material problems, setup and monitoring of line measurables through statistical process controls. Responsible for line quality and acted as liaison to customer plants. Coordinated and directed manufacturing team activities to address issues related to throughput, cycle time, scrap and other manufacturing measurables.

1991 - 1996 ~5 yrs

Power Supply Design Engineer

Reliance Comm/Tec

Responsible for power supply design to meet CSA/UL requirements. Responsible for all aspects of product development; electrical, mechanical, magnetics, PWB layout, prototyping, qualification, manufacturing support/documentation and customer documentation/liaison.Acted as project manager for introduction of new power supplies into manufacturing system. Implemented ATE test system for automatic power supply testing. Responsible for process setup to maximize manufacturing measurables.

1989 - 1991 ~2 yrs
1 education record

Philip Coady education

  • Memorial University, Newfoundland And Labrador
    Memorial University, Newfoundland And Labrador
FAQ

Frequently asked questions about Philip Coady

Quick answers generated from the profile data available on this page.

What is Philip Coady's role at their current company?

Philip Coady is listed as Vice President, Operator Sales at Blonder Tongue Labs.

What is Philip Coady's email address?

AeroLeads has found 1 work email signal at @bellsouth.net for Philip Coady.

Where is Philip Coady based?

Philip Coady is based in Atlanta Metropolitan Area, United States.

What companies has Philip Coady worked for?

Philip Coady has worked for Blonder Tongue Labs, Inc., Fidelis Securities Trading Inc., Adb Global, Vixs Systems Inc., and Entropic Communications.

How can I contact Philip Coady?

You can use AeroLeads to view verified contact signals for Philip Coady, including work email, phone, and LinkedIn data when available.

What schools did Philip Coady attend?

Philip Coady studied at Memorial University, Newfoundland And Labrador.

What skills is Philip Coady known for?

Philip Coady is listed with skills including Semiconductors, Ethernet, Rf, Embedded Systems, System Architecture, Testing, Ic, and Wireless.

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