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Phil R. Germann is listed as Hardware Engineering Manager at Intel Corporation, a company with 133841 employees, based in Austin, Texas Metropolitan Area, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Phil R. Germann.
Phil R. Germann previously worked as Senior Manager, Processor Implementation at Lsi, An Avago Technologies Company and Senior Manager, Custom Microprocessor Integration and Timing at Ibm. Phil R. Germann holds Ms, Electrical Engineering from University Of Minnesota-Twin Cities.
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AeroLeads found 1 current-domain work email signal for Phil R. Germann. Compare company email patterns before reaching out.
I manage several teams spanning hardware development skills, including logic design and verification, physical design, and front-end TFM (tools, flows, methodologies). We provide high-performance IP cores and subsystems to ASIC, semi-custom, and customer SoC offerings within Intel's fast-growing Network and Edge business.One of my professional passions is breaking down barriers and artificial work silos, challenging teams to collaborate and communicate more effectively.My background is in physics, and I specialized in electrical engineering because of my interest in electromagnetic fields and signal analysis.I have spent my career supporting customers through the development of ASICs and SoCs. These chips contain custom and 3rd party processors and subsystems for high-performance software applications (data center, storage, networking, base station + radio, high-performance computing).Specialties include: Management of personnel and programs for processor subsystem development of soft, firm, and hard IP.Signal Integrity and chip packaging; End-to-end system design and analysis.Project planning and execution; Working with clients to define project requirements; global collaboration with clients and colleagues.Mentorship and career development.
Listed skills include Asic, Signal Integrity, Microprocessors, Electronics, and 43 others.
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Austin, TX
Personnel and technical management of digital chip design professionals working on IP development for ASICs and SoCs in wireless networking platforms (base station and radio). Our contributions include: Front-end subsystem development (RTL + verification) High-speed hard macros based on 3rd party CPU Complex subsystem layouts for custom DSP Front-end TFM.
Mendota Heights, MN
Personnel and technical management of chip design professionals who work on implementation of microprocessors (ARM, PowerPC, etc.) and subsystem chip IP. My team is responsible for the logical configuration, synthesis, physical design, timing closure, and release documentation for hard and soft macro designs. Our cores and subsystems are used by a broad.
Rochester, MN
Personnel management responsibilities for chip and unit physical design, timing, and clock development skills on complex custom microprocessors. Work with program managers to define the scope of projects, milestones, schedules, and resource requirements. Facilitate employee development by encouraging collaboration, skill-building, and personal networking.
Electrical analysis, simulation, and budgeting of signal channels; high-speed serial, SerDes, and interface development; power distribution analysis; model development; ASIC and custom silicon package design and characterization (printed circuit boards, chip carriers, system-level channels); lab characterization and model-to-hardware correlation.
Other employees you can reach at intel.com. View company contacts for 133841 employees →
Aseem Athavale
Colleague at Intel CorporationHillsboro, Oregon, United States, United States
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KC
Kishore Chakravorty
Colleague at Intel CorporationSan Jose, California, United States, United States
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PH
Prakash Hamal, Ph.D.
Colleague at Intel CorporationPortland, Oregon, United States, United States
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SD
Selena Ding
Colleague at Intel CorporationHong Kong SAR, Hong Kong
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TH
Tse Hooi Tan
Colleague at Intel CorporationMalaysia, Malaysia
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SC
Siqi Chen
Colleague at Intel CorporationAustin, Texas, United States, United States
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LL
Lorna L
Colleague at Intel CorporationShanghai, China, China
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AG
Akash Gupta
Colleague at Intel CorporationBengaluru, Karnataka, India, India
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BS
Brian Simmons
Colleague at Intel CorporationIreland, Ireland
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BO
Brice Onken
Colleague at Intel CorporationPortland, Oregon Metropolitan Area, United States
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Emphasis: Electromagnetics and Biophysics
Activities and Societies: Tau Beta Pi Sigma Pi Sigma Emphasis: Electrical Engineering
Quick answers generated from the profile data available on this page.
Phil R. Germann works for Intel Corporation.
Phil R. Germann is listed as Hardware Engineering Manager at Intel Corporation.
AeroLeads has found 1 work email signal at @intel.com for Phil R. Germann at Intel Corporation.
Phil R. Germann is based in Austin, Texas Metropolitan Area, United States while working with Intel Corporation.
Phil R. Germann has worked for Intel Corporation, Lsi, An Avago Technologies Company, and Ibm.
Phil R. Germann's colleagues at Intel Corporation include Aseem Athavale, Kishore Chakravorty, Prakash Hamal, Ph.D., Selena Ding, and Tse Hooi Tan.
You can use AeroLeads to view verified contact signals for Phil R. Germann at Intel Corporation, including work email, phone, and LinkedIn data when available.
Phil R. Germann holds Ms, Electrical Engineering from University Of Minnesota-Twin Cities.
Phil R. Germann is listed with skills including Asic, Signal Integrity, Microprocessors, Electronics, Hardware Architecture, Electrical Engineering, Integration, and Hardware.
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