Philip Chen Email and Phone Number
- 12 years of Flip-chip (Die process/Flip chip/backend process) & Wire bonding Assembly experiences as a cross function coordinator and collaborate with Bumping/testing integration, procurement, process engineering team to accomplish product development from NPI to mass production. - Well-experienced on multi-function integration at OSAT/manufacturing site and Product management.- Certificated by ISO26262 (FSCAE)
美商高通國際股份有限公司
View- Website:
- qualcomm.com
- Employees:
- 37431
-
Staff Engineer美商高通國際股份有限公司 May 2020 - Present台灣 新竹市 -
Staff Engineer, Packaging EngineeringWestern Digital Feb 2018 - Apr 2020Hsinchu, TaiwanSSD ASIC/Hybrid (Flip chip + Wire bond) package development. -
Section Manager Of Process Integration(Product Management)-Flip Chip Process矽品精密工業股份有限公司 Oct 2015 - Feb 2018台灣 台中市 -
Senior Process Integration Engineer(Product Management)-Flip Chip Process矽品精密工業股份有限公司 Jul 2013 - Oct 2015 New product introduction program management engineer - Responsible for all new customer products for engineering, manufacturing, planning and logistics related milestones and deliverable. Ensuring manufacturing standardization such as BOM and Process flow. Cost Of Goods and Services are being identified and are properly structured and accurate using the most effective methods and technologies. Review and evaluate customer's requirements and serve as interface to answer technical… Show more New product introduction program management engineer - Responsible for all new customer products for engineering, manufacturing, planning and logistics related milestones and deliverable. Ensuring manufacturing standardization such as BOM and Process flow. Cost Of Goods and Services are being identified and are properly structured and accurate using the most effective methods and technologies. Review and evaluate customer's requirements and serve as interface to answer technical questions and provide solutions within the process capability, roadmap, process flow and design rules of the factory Determine project technical specifications, communicate to the technical staff in factory and monitor the projects for successful qualification of products and align product roadmap between customer and assembly sites. Show less -
Process Engineer-Wire Bonding矽品精密工業股份有限公司 Dec 2011 - Jul 2013
Philip Chen Skills
Frequently Asked Questions about Philip Chen
What company does Philip Chen work for?
Philip Chen works for 美商高通國際股份有限公司
What is Philip Chen's role at the current company?
Philip Chen's current role is Staff Engineer at Qualcomm.
What schools did Philip Chen attend?
Philip Chen attended 國立成功大學, 國立成功大學.
What are some of Philip Chen's interests?
Philip Chen has interest in Science And Technology, Environment.
What skills is Philip Chen known for?
Philip Chen has skills like Semiconductors, Cross Functional Team Leadership, Engineering Management, Product Development, Spc, Program Management, Ic, Product Management.
Who are Philip Chen's colleagues?
Philip Chen's colleagues are Sudani Dinesh, Fengjiang Guo, Patalam Rithish, Jenny Palmberg, Erik Earl, Preetha Subramanian, Shubham Deshmukh.
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Philip Chen
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