• Manager and individual contributor within IFS responsible for Burn In/HTOL/Fuses/V93K SW-HW Integration.• Key test program developer on MRAM burn in tester, supporting DOEs, product qualifications, and hardware debug.• Supporting V93K ATE HW-SW Integration (SMT7, SMT8), enabling seamless automation solutions for remote volume testing.• Liaison between external test vendor and local test team, coordinating DOEs and vendor qualifications.

• Manager and team lead for Optane memory HVM/NPI Component Burn In at OSAT manufacturing test.• Key test program developer on Optane memory ATE burn tester, supporting DOEs, production releases, qualifications, and hardware debug.• Delegates activities to ensure both test program and product health goals are met.• Liaison between OSAT MFG test team and local team.

• Developer of manufacturing burn in firmware and burn in test program (Nextest Maverick, NeosemSXBI2) for next generation systems memory product.• Coordinated with product engineers to define test requirements/methodology to minimize known manufacturing defects outgoing ODM.• Worked with system planners and ODM to adhere to product delivery commitments.• Supported ODM manufacturing ramp and sustaining activities both local and abroad through handoff of product test programs, process definitions and improvements, and through onsite failure analysis• Continuous driver of test time reductions and test method optimizations.

• Core developer of both Advantest ATE T5375 and JEC P35XX/B6700 BURN IN NAND component test tapes for subcon manufacturing. • Facilitated and continuously drove test time reductions and yield improvements through the manipulation of tester features/architecture and device knowledge.• Supported manufacturing ramp up of subcon test site/ODM and provided onsite ODM support and failure analysis.

Developed customer level functionality test tapes and screens to qualify non-Intel memory products including 90nm Nand, 72nm Nand, and various iterations of DDR / xRAM products.